MicroLED and AR/VR Connect 2025: The Year’s Must-Attend MicroLED and AR/VR Display Industry Gathering

khasha8
Aug 13
3 min read

Introducing the program for MicroLED Connect 2025 and AR/VR Connect 2025 (Conference and Exhibition, 24 &25 Sept 2025, High Tech Campus, Eindhoven, Netherlands) This event is shaping up to be the definitive global forum for microLED and AR/VR display professionals, offering an exceptional program, vibrant exhibition, and unmatched networking opportunities.

In this preview, we’ll spotlight several speakers, showcase selected conference themes, and give you a glimpse of what awaits in Berlin. For the complete agenda and event details, click here.

Mass Transfer – From Wafer to Display

In many icroLED manufacturing platforms, at least one major transfer process is required—often two. Typically, devices move from the epiwafer to an intermediate interposer substrate and later from the interposer to the final display. Executing this step with precision, speed, and cost efficiency remains one of the industry’s most persistent challenges.

At MicroLED Connect 2025, leading innovators will unveil new solutions:

Coherent will present a fully integrated laser-based mass transfer system designed to handle donor wafers and receiver panels—whether they’re backplanes or temporary carriers. Offering exceptional throughput, yield, and flexibility, the system can manage even the tiniest microLED dies.
Holst Centre will introduce a proprietary release stack enabling rapid, selective microcomponent release with adaptive pitch using a cost-effective laser source. Recent results show sub-0.5 μm transfer precision for ultra-thin InP coupons with extreme aspect ratios.
Advanced View Technology (Korea) will share its high-accuracy electrofluidic assembly process for transferring InGaN-based blue nano-LEDs—providing a potential leap beyond OLED and current microLED microdisplay limits.

Smartkem (UK) will update on its Chip-First OTFT backplane process, where the backplane is built directly onto the LEDs, unlocking a new manufacturing paradigm for microLED displays.

At MicroLED Connect 2025, leading innovators will unveil new solutions:

Coherent will present a fully integrated laser-based mass transfer system designed to handle donor wafers and receiver panels—whether they’re backplanes or temporary carriers. Offering exceptional throughput, yield, and flexibility, the system can manage even the tiniest microLED dies.

Holst Centre will introduce a proprietary release stack enabling rapid, selective microcomponent release with adaptive pitch using a cost-effective laser source. Recent results show sub-0.5 μm transfer precision for ultra-thin InP coupons with extreme aspect ratios.

Advanced View Technology (Korea) will share its high-accuracy electrofluidic assembly process for transferring InGaN-based blue nano-LEDs—providing a potential leap beyond OLED and current microLED microdisplay limits.

Smartkem (UK) will update on its Chip-First OTFT backplane process, where the backplane is built directly onto the LEDs, unlocking a new manufacturing paradigm for microLED displays.

MicroLED Growth – GaN, Nanowires, and Nanopyramids

From epitaxy breakthroughs to novel nanostructures, new growth techniques are pushing microLED performance to new heights. At MicroLED Connect 2025, innovators will reveal methods for creating smaller, brighter, and more efficient devices:

Hexagem (Sweden) will showcase a bottom-up InGaN process for producing dislocation-free hexagonal platelets with tunable emission from blue to deep red (>670 nm). This plasma-damage-free approach delivers up to 60% IQE for deep red quantum wells, with red devices maintaining >630 nm wavelengths at drive currents up to 50 A/cm²—ideal for ultra-bright, wide-gamut displays.
CEA-Leti (France) will present progress on monolithic RGB InGaN nanopyramids grown via MOVPE on patterned epitaxial graphene/SiC masks, achieving <1 µm diameters with outstanding optical properties.
Veeco (USA) will show how its MOCVD systems enable the world’s smallest microLED emitters, highlighting recent deposition breakthroughs.
Two Photon Research Inc. (USA) will reveal a kinetic Monte Carlo simulation platform for modeling selective area GaN nano-column growth, offering deep insight for optimizing high-performance microLEDs.

Hexagem (Sweden) will showcase a bottom-up InGaN process for producing dislocation-free hexagonal platelets with tunable emission from blue to deep red (>670 nm). This plasma-damage-free approach delivers up to 60% IQE for deep red quantum wells, with red devices maintaining >630 nm wavelengths at drive currents up to 50 A/cm²—ideal for ultra-bright, wide-gamut displays.

CEA-Leti (France) will present progress on monolithic RGB InGaN nanopyramids grown via MOVPE on patterned epitaxial graphene/SiC masks, achieving <1 µm diameters with outstanding optical properties.

Veeco (USA) will show how its MOCVD systems enable the world’s smallest microLED emitters, highlighting recent deposition breakthroughs.

Two Photon Research Inc. (USA) will reveal a kinetic Monte Carlo simulation platform for modeling selective area GaN nano-column growth, offering deep insight for optimizing high-performance microLEDs.

Full-Color Strategies – QDs, Native Red, and Tunable Emission

Delivering vibrant, full-color microLED displays can follow multiple routes—native RGB, color conversion, or tunable LEDs. MicroLED-Connect will cover all approaches with updates from global leaders:

QNA Technology will present a UV-LED + QD conversion approach, eliminating pixel crosstalk and enabling high efficiency.
Panasonic Production Engineering will detail its precision inkjet printing platform for depositing quantum dots, featuring novel ink circulation, pulsation minimization, and per-nozzle waveform control.
Raysolve Optoelectronics (China) will showcase a wafer-level full-color microdisplay (0.13”, 320×240 resolution, 500,000 nits peak brightness) using QD-based color conversion.
Innovation Semiconductors will introduce a monolithic, single-emitter color-tunable microLED architecture leveraging crystal plane variations and V-groove geometry.
Aledia (France) will update on GaN nanowire NanoLEDs, enabling RGB emission from the same material system by tuning nanowire size.

Panasonic Production Engineering will detail its precision inkjet printing platform for depositing quantum dots, featuring novel ink circulation, pulsation minimization, and per-nozzle waveform control.

Raysolve Optoelectronics (China) will showcase a wafer-level full-color microdisplay (0.13”, 320×240 resolution, 500,000 nits peak brightness) using QD-based color conversion.

Innovation Semiconductors will introduce a monolithic, single-emitter color-tunable microLED architecture leveraging crystal plane variations and V-groove geometry.

Aledia (France) will update on GaN nanowire NanoLEDs, enabling RGB emission from the same material system by tuning nanowire size.

Why You Should Attend

These three themes represent only a fraction of the content on offer. The agenda spans display makers, AR developers, materials specialists, equipment suppliers, investors, and more. MicroLED-Connect 2025 is your chance to see the newest display prototypes, gain insider knowledge, and make industry-defining connections.

Early-bird pricing is available until 15 August—reserve your place today.

The Exhibition – Meet the Entire Supply Chain

The MicroLED-Connect exhibition gathers the full ecosystem—equipment vendors, material innovators, panel makers, and solution providers—under one roof.

View the floor plan and exhibitor list here. A limited number of booths remain; contact us if you want to showcase your technology to a highly targeted microLED audience.