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Ultrathin Flexible ICs For Flexible Electronics

Speaker: Jean-Charles Souriau | Company: CEA| Date: 11-12 May 2021 | Full Presentation

ChipInFlex is CEA-Leti's latest development towards the integration of ultra-thin, bare silicon chips within a flexible film. Today, electronic systems are becoming smaller, thinner and, above all, flexible. Flexibility makes possible new functions and hence new usages. With Chip-In-Flex, CEA-Leti is introducing a new paradigm for integrating ultra-thin, bare chips into a flexible label made on a silicon wafer.

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