Printed, Hybrid, Structural & 3D Electronics. |

Schedule

Get Tickets

  • 10 minutes

    TechBlick - Introduction

  • 20 minutes

    IDENTIV - NFC & UHF Flexible & Hybrid Sensor Tags

  • 20 minutes

    Smooth & Sharp - Printed RFID inlay in Mass Production Scale as basis for further FHE product

  • 20 minutes

    CPI - Applications Utilising Roll to Roll Fexible Hybrid Electronics

  • 20 minutes

    Enjet -High-Resolution Printing from 2D to 3D for Additive Manufacturing of Printed Electronics

  • 20 minutes

    XTPL - High-Resolution 3D-Printed Conductive Features In Single Micron Scale

  • 20 minutes

    US Army Research Lab - Hybrid Electronics: Expanding manufacturing options for electronic assembly and packaging

  • 20 minutes

    Networking Break

  • 20 minutes

    CEA - Ultrathin Flexible ICs For Flexible Electronics

  • 20 minutes

    ARM - Towards Natively Flexible ICs

  • 20 minutes

    Coatema - Improvement of yield and performance of OPV by using inline quality control systems & process monitoring”

  • 20 minutes

    SUNEW - OPV Production Scale-Up & Installation Challenge

  • 20 minutes

    American Semiconductor -State-of-the-Art and Issues for Bluetooth® Flexible Hybrid Electronics (FHE)

  • 20 minutes

    Texas Instruments - Semiconductor and Printed Electronics Industries: Overview of emerging applications

  • 20 minutes

    Brilliant Matters -New Generation Of Photovoltaic Materials

  • 20 minutes

    Parsons - Design & Manufacture of Test Coupons for Risk Reduction Studies of Printed Hybrid Electronics Assemblies

  • 20 minutes

    Phillips 66 - Photoactive Polymers Tailored to Industrial Printing of High Performing and Stable Organic Photovoltaics

  • 20 minutes

    Networking Break

  • 20 minutes

    Ntrium - Recent EMI Shielding Process for Advanced Packaging

  • 20 minutes

    Alpha Assembly -Ultralow Temperature Solder For Flexible Hybrid Electronics

  • 20 minutes

    ACI Materials - ACI Alchemy Conductive Inks -Enabling Next Generation Flexible & 3D Electronics

  • 20 minutes

    CondAlign - Advantages With Anisotropic Conductive Adhesive Films Comprising Aligned Particles

  • 20 minutes

    Agfa/Nanogate - Printed Electronics made with Digital Printing: Materials and Application in Motor Sport

  • 20 minutes

    Safi-Tech -Supercooled Fully Metallic FHE Interconnect Technology

  • 20 minutes

    NovaCentrix - PulseForge Soldering – Using flash lamp technology for conventional solder alloy reflow

  • 20 minutes

    VSParticle - Accelerating the development of new value added materials

  • 20 minutes

    DuPont Teijin Films/Fraunhofer FEP - Advances in Polyester Film Substrates for Flexible Electronics

  • 20 minutes

    C3Nano - Platform Optoelectronic Materials: Flexible, Rollable, Large-Area, Biotech & Beyond

  • 20 minutes

    Panasonic - Development of Stretchable, Conformable and Pliable Circuit Materials

  • 20 minutes

    Metamaterial Inc (META) - The Dawn of Electro-Optics: Emerging Multi-functional and High-Performance Metamaterials

  • 20 minutes

    Procter & Gamble/Coca-Cola - Panel Discussion - Smart & Intelligent Packaging

  • 10 minutes

    TechBlick - Welcome & Introdution

  • 20 minutes

    Wuerth - Challenges & Opportunities of AM in Passive Electronic Industry – A Practical Approach on Materials, Designs an

  • 20 minutes

    Signify - Hybrid manufacturing of 3D integrated electronics for LED lighting

  • 20 minutes

    VTT - Roadmap Towards More Environmentally Friendly Electronics

  • 20 minutes

    Prismade - Secure, invisible and green printed electronics. A journey from ID cards to gamification and to blockchain it

  • 20 minutes

    Networking Break

  • 20 minutes

    Kimoto - Application of Flexible Light Diffusion Films in User Interfaces

  • 20 minutes

    PolyIC - Smart HMI surfaces with inmolded touch sensors and decoration

  • 20 minutes

    Kundisch - Applications using Printed and Hybrid Electronics in the HMI Industry

  • 20 minutes

    Sheldahl - The Evolution or Revolution of the Human Machine Interface Market

  • 20 minutes

    e2ip/ Nat Research Council of Canada- Molecular Ink applied to Printed & In-Mold Electronics

  • 20 minutes

    Networking Break

  • 20 minutes

    Danish Technology Institute /ACCIONA - LEE-BED: Services and infrastructure within printed and embedded electronics

  • 20 minutes

    Brewer Science - Printed Smart Devices: Enabling Widespread, Real-Time Sensing

  • 20 minutes

    Applied Materials - Advanced screen printing for PE: two case studies of industrial applications in medical and display

  • 20 minutes

    Hewlett Packard - HP’s 3D Printing of Electronics using Multi Jet Fusion

  • 20 minutes

    IDS - NanoJet: The Next Generation in Aerosol Printing

  • 20 minutes

    NanoOps -High-Throughput Wafer Printing of Nano and Microelectronics: A Fab in A Tool

  • 20 minutes

    Airbus/Boeing - Panel Discussion - Opportunities & Challenges for Printed Hybrid Electronics in Aerospace