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Author: Dennis Kuppens – Product Manager at SUSS Microtec Netherlands b.v. At SUSS MicroTec, our vision is to lead the way in enabling innovative semiconductor advanced backend and photomask solutions. In this article, we will explore how this vision extends beyond our own innovations to enable third-party innovation through SUSS PiXDRO inkjet technology. For years, the SUSS LP50 R&D Inkjet printer, featuring PiXDRO technology, has set the standard for researchers and engineers in developing and validating inkjet inks and processes, from R&D to high-volume production, across universities, research institutes, high-tech startups, and multinational companies. Whether you start in an ink development phase, a prototype development phase or a pilot-production phase, the LP50 printer can be configured and even field-upgraded to suit your current and future development needs. The 500+ research papers which are published on Google Scholar are a firm testimony to this. These articles highlight a wide variety of innovative applications where inkjet technology is being used for functional devices. All the papers have been submitted by users of SUSS LP50 printers, with more than 400 printers installed and used daily by researchers worldwide. Below are three abstracts of the most recent publications that can be found on Google Scholar. Development of a Screening Platform for Optimizing Chemical Nanosensor Materials (Published: Aug 24, 2024) https://www.mdpi.com/1424-8220/24/17/5565 Inkjet-printing and characterization of undoped zinc oxide thin films (Published: Aug 5, 2024) https://www.sciencedirect.com/science/article/abs/pii/S0925346724011145 Compact multispectral light field camera based on an inkjet-printed microlens array and color filter array (Publication: June 17, 2024) https://opg.optica.org/oe/fulltext.cfm?uri=oe-32-13-23510&id=551644 Summary These publications are a perfect illustration of how SUSS realizes its vision of enabling innovation. Beyond the three applications discussed, there are over 500 studies on the use of inkjet technology with the SUSS LP50 printer available on Google Scholar. These studies span various fields, including semiconductors, PCBs, flexible devices, pharmaceuticals, battery technology, medical devices, printed electronics, OLED display technology, and more. You can access all these papers through the LP50 website: https://lp50.suss.com Are you inspired? Reach out to SUSS to discover how we can support and enhance your innovation. We are eager to assist with your projects, collaborate on ink development, or provide the LP50 as a platform for your modules and business needs. You can fill out a web form on the LP50 website to get started: https://lp50.suss.com and explore other innovative products here www.suss.com   References: Development of a Screening Platform for Optimizing Chemical Nanosensor Materials (Published: Aug 24, 2024) -   https://www.mdpi.com/1424-8220/24/17/5565 Inkjet-printing and characterization of undoped zinc oxide thin films (Published: Aug 5, 2024) - https://www.sciencedirect.com/science/article/abs/pii/S0925346724011145 Compact multispectral light field camera based on an inkjet-printed microlens array and color filter array (Publication: June 17, 2024)  - https://opg.optica.org/oe/fulltext.cfm?uri=oe-32-13-23510&id=551644 Google Scholar - https://scholar.google.com/scholar?q=lp50+pixdro   We are exhibiting! We look forward to meeting you at our booth  at one of the most significant industry and research events "The Future of Electronics RESHAPED" in Berlin, Germany on 23-24 October 2024. We invite our friends, partners and customers to visit and take this opportunity to connect with the brilliant innovators showcasing their latest advancements with this cutting-edge technology. Experience a world-class programme, featuring 72 invited presentations, 80 exhibitors and over 600 global attendees. You can explore the programme here. Join us and RESHAPE the Future of Electronics, making it Additive, Sustainable, Flexible, Wearable and 3D. TechBlick events are designed to deliver an inspiring customer experience Register as our guest with this discount code: Suss

Ayer, MA September 2024 - Creative Materials Inc., an innovator of materials for the electronics industry, is pleased to announce the launch of two new high performance ink products: 125-10ADP Economical Conductive Ink and 130-05GL High Dielectric Strength Ink. These advanced inks represent a significant advancement in the realm of electronic manufacturing providing enhanced performance, reduced costs, and greater reliability. 125-10ADP Economical Conductive Ink The 125-10ADP Economical Conductive Ink is designed to meet the growing demand for cost-effective solutions without compromising performance. This ink is user friendly, offers high mechanical strength, electrical conductivity and excellent adhesion to a variety surfaces, making it ideal for use in a variety of applications including membrane switches, flexible electronics, printed circuit boards (PCBs), and sensors. Key features of the 125-10ADP ink include: Reliability: Delivers consistent electrical performance with low resistivity. Cost-Effectiveness: Provides a high-quality solution at a competitive price, enabling cost savings for manufacturers. Versatility: Suitable for use on a wide range of substrates, including treated and untreated polyester, urethanes and polyimide. 130-05GL High Dielectric Strength Ink In parallel, the 130-05GL High Dielectric Strength Ink addresses the critical need for materials with outstanding insulation properties. This novel ink is engineered to provide high dielectric strength (2,500 volts/mil). 130-05GL is a high gloss ink particularly suited for flexible cross-over circuitry applications.   We are exhibiting! Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.    Notable benefits include: High Dielectric Strength: Ensures insulation and safety in high energy products. Mechanical Durability: Offers enhanced resistance to environmental stressors such as abrasion, humidity, and temperature fluctuations. Flexibility: Maintains performance across a range of operating conditions and substrates. Driving Innovation and Efficiency “Creative Materials is committed to pushing the boundaries of material science to deliver products that drive innovation in the electronics industry,” said Matthew Ganslaw, Executive Vice President of Creative Materials Inc. “With the introduction of 125-10ADP and 130-05GL inks, we are providing our customers with solutions that not only meet, but exceed the demands of modern electronic applications, while also helping them achieve greater efficiency and cost-effectiveness.” About Creative Materials Inc Founded in 1987, Creative Materials Incorporated develops, manufactures, and delivers customized inks, adhesives, & coatings, that are designed and optimized for each client’s specific product requirement while continuously exceeding the highest quality standards, and providing the most responsive engineering and customer service support in the industry. Contact: Call to speak with an application support specialist today at 1-800-560-5667 or email us at info@creativematerials.com We are speaking! Join us at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.

On 22 October 2024, the day before the Future of Electronics RESHAPED conference and exhibition opens its doors, you can participate in a day of industry- and expert-led masterclasses. These sessions offer a unique blend of technology, application, and practical insights, providing a valuable opportunity to learn the latest advancements, acquire new skills, or refresh your existing knowledge. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Masterclass Themes Material Innovations, Developments, and Application Advances Polymer Thick Films : This topic has always been, and will remain, fundamentally important to the entire printed electronics industry. The instructor for this class is Saeed Madadi from Celanese. Liquid Metals : One of the most exciting emerging materials in printed, soft, and stretchable electronics, liquid metals offer amazing properties. This class will be instructed by leading researcher Mahmoud Tavakoli from the University of Coimbra . Electroactive Polymers : This is an important class for anyone interested in haptics, actuators, and sensors based on piezoelectric technology. The class will be jointly instructed by Fabrice Domingues Dos Santos from Arkema and Valerio Zerillo from Kemet. Wearables and E-Textiles Manufacturing Wearable Sensors:  In this class, you will learn about wearable sensors and their typical applications. Additionally, you'll gain insights into the technical requirements and materials commonly used in printed wearable sensors, with a focus on cost considerations and manufacturing challenges. This class is taught by Mikko Paakkolanvaara from Screentec, a company with years of experience in printed wearable sensors. Mastering Electronics Integration Into Textiles and Wearables:  This is a crucial class for anyone interested in e-textiles. The integration of electronics into textiles and wearables is a critical aspect that affects manufacturing and all facets of product design. In this class, you will learn about the key methods for successful integration. The class is instructed by Guus De Hoo, from Elitac Wearables,  who has extensive experience in electronic integration into textiles. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Manufacturing Flexible Hybrid Electronics R2R Flexible Hybrid Electronics:  This is a must-attend class for anyone interested in performing roll-to-roll (R2R) production of flexible hybrid electronics. The course covers printing techniques, assembly methods, and testing processes. The class is offered by  Ashok Sridhar from TracXon , who brings unique insights from his research background at the Holst Centre and his current R2R FHE manufacturing activities at TracXon. Chip Interconnections for Flexible Printed Electronics:  This is a critical topic for anyone interested in placing SMT components on flexible substrates, where the choice of interconnect technology plays a pivotal role. You will learn from Aviv Ronen of Beckermus Technologies,  who is ideally positioned to teach this class due to his research on solder and interconnect technologies and the work of Beckermus Technologies in R2R manufacturing of flexible hybrid electronics. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Digital Printed, Additive and 3D Electronics  Digital Additive Manufacturing:  This class offers an overview of various digital printing electronics processes, including inkjet, aerosol, electrohydrodynamic (EHD), microdispensing, and more. It's a valuable class for anyone interested in working with digital additive electronics techniques. The class is instructed by Neil Chilton of Printed Electronics Ltd. Optimizing Inkjet Processes:  This is an essential class for anyone currently printing electronics with inkjet or looking to start. The class, taught by Jochen Christiaens from ImageXpert , will teach how to optimize the printing process to improve print performance and stability while saving development time. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Sustainable, Green and Circular Electronics How to Improve Sustainability in Electronics:  This class is an excellent introduction for anyone interested in green electronics. It covers the latest trends and needs in sustainable and circular electronics, focusing on changes in materials, manufacturing processes, designs, and business models that enable circular electronics. The class is offered by  Liisa Hakola from VTT. Role of Bio-based Materials in Additive and Sustainable Electronics:  This class provides valuable insights into how bio-based and nature-inspired materials can replace synthetic and non-sustainable materials in electronics, impacting all aspects of electronic design and manufacturing, including printed and additive electronics. The class is offered by Jesper Edberg from RISE Research Institute of Sweden. Sustainable and Circular Printed Electronics:  This unique class explores how materials and components in printed, flexible, hybrid, or in-mold electronics—where electronics might be fused together—can be recovered, addressing the challenges of end-of-life treatment in hybrid and printed electronics. The class is offered by Stephan Harkema, an expert researcher at the Holst Centre. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Tours After the masterclasses you can participate at a tour of your choice. You have a choice of four insightful tours covering themes such as inkjet printed OLED lighting, high viscosity jetting head technology, PCB and electronic manufacturing technologies and advanced material research. The tours include: Fraunhofer IZM, Fraunhofer IAP, Quantica GmbH, and Inuru Explore and Register Before 11 October When The FINAL Early Bird Rate Ends

TechBlick The Future of Electronics RESHAPED - Why You Should Join Us. 23 & 24 October 2024 | Berlin, Germany TechBlick have prepared a world-class agenda for you, featuring over 70 superb invited talks, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. You can explore the full program here . In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased.  In this article, we discuss the theme of   Additive and 3D Electronics, highlighting talks, masterclasses and tours from the likes of Airbus, Semikron Danfoss, Ceradrop, NeoTech AMT GmbH, Hasselt University, Karlsruhe Institute of Technology, Hahn-Schickard Institute, PERC, Binghamton University, University of Texas El Paso, Tecnalia. Note that this is the second article on the theme of Additive and 3D Electronics . In the previous article, we highlighted contributions from the European Space Agency, Yole Group, Decathlon, LPKF Laser & Electronics, Exxelia Micropen, Fuji Corp, Elephant, Nano OPS, Notion Systems, and Henkel and Tecna-Print, Printed Electronics Ltd, ImageXpert, Quantica. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Airbus  will share their findings on the durability of 3D printed and hybrid electronics under aeronautic conditions. The motivation here is the direct integration of electronics on composite structures. In this case, flexible hybrid electronics embedded in TPU foils are integrated on aeronautic composite coupons. In this study, the durability of these devices is investigated. In parallel, test results on the durability of additively manufactured electronics are also presented. This is an important theme as there is a lack of information on such topics today.  Semikron Danfoss:  For users and designers, the landscape for additive electronics is complex, given the breadth of materials and princess. Here a classification is presented from the perspective of the application, helping the user identify useful tools, methods and materials which are needed for simple or very complex AME projects. This is an important project that will help users, designers, hard- and software vendors - also those from outside the AME industry- to benefit from this discussion and launch project. This is an important contribution in lowering barriers to commercial adoption. Ceradrop:  This is a talk focused on enabling industrialization with digital printed electronics processes. This is an important theme since many applications are transitioning from prototyping to mass production, and often find that the transition is not very straightforward. Ceradrop will present how their equipment solutions enable a seamless transition, and in doing so will highlight specific use cases.  Neotech AMT GmbH: This talk focuses on the fundamental technology combining free-form, 5-axis 3D printing of mechanical and electronic components, Surface Mount Device (SMD) placement and pre- and post-processing techniques. This is an advanced form of 3D printed electronic technology, offering design freedom, local production, as well as opportunities to create sustainable mechatronic systems. In this talk, you will also learn about the specific use case of a 3D-printed lighting product.  Explore and Register Before 11 October When The FINAL Early Bird Rate Ends PERC:  In this talk, by one of the most important centers for printed electronics R&D in the US, you will learn about Additive Manufacturing for Advanced Microwave and RF Applications. This talk addresses all the key challenges in additive manufacturing of high-frequency electronics including including UV curable low-loss dielectric, resistive, and ferroelectric inks. Furthermore, the talk will present examples of additive packaging including, design, fabrication, and characterization of a non-planar multi-material MMIC structure as well as bare-die integration and tunable Frequency Selective Surface (FSS) based filters, wearable metasurface filters, and printed connectors  University of Texas El Paso:  This is an important research direction which integrates functional content in mass-customized structures, thus creating true 3D-printed electronics. Here the underlying technology developments are reviewed and the presentation will also outline specific examples of multi-process 3D printing for creating structures with consumer-anatomy-specific wearable electronics, electromechanical actuation, and electromagnetics in ceramic structures.  Hahn-Schickard Institute : In this talk, a hybrid printing system is introduced. Here the polymer/dielectric substrates can be directly printed from FFF technology. The StarJet technology is directly integrated into the 3D printing system as the 2nd extruder which prints the bulk metal (e.g. SAC305 solder) through digital and non-contact deposition of the molten metal droplets or Jet. This technique achieves bulk electrical conductivity, conformal printing, no pre- and post-treatment, and high compatibility on flexible substrates due to solvent-free printing. Furthermore, when the bulk solder (e.g. Tin silver copper alloy) is used for the molten metal printing, the SMD components can be directly soldered and bonded onto the large-area flexible substrates, eliminating the troublesome solder reflow process. This is an innovative technology addressing many traditional technology shortcomings in 3D printed electronics. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Karlsruhe Institute of Technology: This talk presents a novel Aerosol-on-Demand (AoD) jet-printing system which overcomes issues of traditional digital printing of electronics. Here, the aerosol is generated from a point-like source within the printhead and is then hydrodynamically focused, enabling one to achieve the printing of discontinuous microstructures without ink loss and the need for a shutter. This novel system holds great promise for 2D, 2.5D, and 3D electronics printing with aerosol.  Tecnalia Research & Innovation:  This talk focuses on composite functionalization via printing, adding even more value to fibre-reinforced plastics. You can learn how advances in printing and manufacturing technologies enable the integration of electronic functionality onto composites without compromising their properties. You can learn about processes, materials, and specific demonstrators.  Hasselt University:  This talk focuses on thermoformed 3D electronics. Here, the study reports on the process of screen printing of conductive Ag-based inks on different 2D foils and the subsequent thermoforming of the same to achieve 3D circuit layers on which, afterwards, rigid electronics can be placed via the use of pick-and-place and conductive adhesives. The process and the different foils and inks are discussed in detail in this work. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Exhibition Of course, the exhibition is the key place where you can find partners across the entire value chain, including equipment manufacturers, ink and paste formulators, print houses, and more. There will be over 80 exhibitors from around the world. You can see the floor plan and learn about the exhibitors here . At the exhibition, you will also meet many key players developing equipment, materials and services for additive (digital) and 3D electronic printing. Such exhibitors include: Notion Systems, Voltera, Heraeus Printed Electronics, ImageXpert, Printed Electronics Limited, IDS, Hummink, Fuji,  MAAS, Neotech AMT, Nano Ops, Quantica, SüssMicrotec, XTPL, Atlant 3D, Ceradrop, DoMicro, Exxelia, Teca Print, and PrintedUp Institute, BotFactory, and more.  Some companies offering digital and/or 3D-printed electronics Notion Systems Voltera Heraeus Printed Electronics ImageXpert PEL IDS Hummink Fuji MAAS Neotech AMT Nano Ops Quantica SüssMicrotec XTPL Atlant 3D Ceradrop DoMicro Exxelia Teca Print PrintedUp Institute BotFactory Explore and Register Before 11 October When The FINAL Early Bird Rate Ends

Visit The Latest Industry and Research Highlights On 22 October 2024, the day before the Future of Electronics RESHAPED conference and exhibition opens its doors, you can participate in a day of industry- and expert-led masterclasses and tours. See the program below. In addition to the tours and masterclasses you will have access to ✅ 75 invited onsite conference talks ✅ 83 onsite exhibitors ✅ 12 expert-led masterclasses ✅  4 tours ✅ Annual online access to TechBlick platform Library of content featuring over 1500 talks (PDF and video) from all past online as well as onsite events around the world Access to all future online events within access period Access to on-demand version of all talks and masterclasses at upcoming onsite events including MicroLED Connect (Eindhoven, Sept 2024) and Future of Electronics RESHAPED (Boston, June 2025) Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Tour Themes After the masterclasses, you’ll have the option to participate in one of the following themed tours: Fraunhofer IZM Fraunhofer IZM’s focus is on packaging technology and the integration of multifunctional electronics into systems. Fraunhofer IZM was founded in 1993 and is today one of the global leaders in microelectronics and microsystems packaging The guided tour at Fraunhofer IZM is organized by three working groups:  System on Flex  This group is working on advancing flexible hybrid electronics, stretchable electronics, and electronic textiles. During the tour, you can visit various labs and cleanrooms. #AssemblyTechnologies #FlipChipBonding #Fine Patterning of Flexible and Stretchable Substrate #Integration of Microelectronics Into Flexible and Stretchable Substrates #Lamination #LaserPatterning #Mechanical Drilling #Thermoforming Technologies for Bioelectronics This group designs, fabricates, and tests active neural interfaces and flexible, biocompatible implants for neural stimulation and recording. They explore new methods for stimulation and wireless power transfer. During the tour, you can visit their specialized facilities. Sensor Development and Integration  This group develops micromechanical sensors for various applications. #TextileLabs #MechanicalTestingLab #FlexibleElectrodeProduction #Implantables #SmartTextiles #NeuralSimulation Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Inuru Possibly the only company worldwide printing OLED lighting, they have simplified the process by utilizing inkjet printing, making printed OLED lighting affordable. This is an advanced printed electronics production facility. This is a unique opportunity to visit Inuru and its facilities. #OLEDLighting #SmartPackaging #Branding #InkjetPrinting Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Fraunhofer IAP Fraunhofer IAP is developing future-oriented solutions throughout the polymer and nanomaterial value chain. On this tour, attendees will gain insights into the research divisions of "Functional Polymer Systems," "Biopolymers," and "Polymeric Materials and Composites." You will be guided through Fraunhofer IAP's pilot plants and labs on-site in Potsdam, including the clean room area for printed electronics, the pilot plant for fiber technology (from spinning to carbonization), and labs for polymer and quantum dot synthesis. Key topics include #QuantumDots, #PerovskitePhotovoltaics, #OrganicPhotovoltaics, #PolymerSolidStateBatteries, and #PFAS-Free Fuel Cell Membranes. Quantica Quantica is an advanced additive manufacturing company headquartered in Berlin, Germany. Their innovative inkjet-based technology enables  the digital deposition of high-viscosity and high particle-load materials. With their advanced systems, users can print and combine new materials seamlessly in a single process for 2D and 3D application development. From car coatings to printed electronics to hearing aids, Quantica's technology offers an innovative new solution. On this tour, attendees will gain insight into the research and development behind Quantica's printheads and systems. Additionally, they'll have the opportunity to witness a live printing demonstration, showcasing the technology firsthand. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Masterclasses The tours take place after our masterclass program where you can learn the latest on some of the most important themes and technologies in the field, including:​ Polymer Thick Films Liquid Metals Sustainable Electronics Mass Production of Medical Wearables Electroactive Polymer Actuators and Sensors Interconnect Technologies for SMT on Flex R2R Production of Flexible Hybrid Electronics Digital Additive Electronics Technologies Methods To Optimise InkJet Printing of Electronics Green and Circular Additive Electronics Bio and Green Electronic Materials Integration of Electronics Into Textiles You can see the full program here Online Masterclasses You can, of course, have access to the full portfolio of on-demand masterclasses. These were delivered onsite at our past TechBlick events in Boston 2024, Berlin 2023, and Eindhoven 2022 as well as online. Furthermore, with the Hybrid Annual Pass, you will have access the onsite masterclasses to be delivered this September in Eindhoven on MicroLED, AR/VR and Display Technologies as well as masterclasses which are to be delivered in Boston 2025 on printed and additive electronics. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Eindhoven 2024 | Coming Soon IQE | MC1:MicroLED LED Epitaxy Holst Centre | MC2: Enabling solutions for mass-transfer of microLEDs Coherent | MC3:Laser Technology in Mini- and MicroLED Fabrication: from Mass Transfer to Bonding and Repair InZiv | MC4: Inspection and Repair Technologies in Micro and MiniLED Manufacturing UBI Research | MC5: ARV/VR technologies, trends, and markets* Hendy Consulting | MC6: An overview of the MicroLED industry and market Fraunhofer IAP | MC7: Quantum Dot and Color Conversion Technologies* Scrona | MC8: EHD and Inkjet Printing in MicroLEDs: From Repair to Color Conversion Boston 2024 | Watch Now Innovation Collaborative Centre (C2MI)  | Interconnect Technologies for Integrating Rigid Components in Flexible Hybrid Electronics Applications. Nagase ChemteX  | Conductive Inks and Pastes: Technologies and Applications VTT  | Full R2R Process Flow for Flexible and Hybrid Electronics with Test and Verification Aspects NC University  | Liquid Metal Technology: Technologies, Applications, Practice and State-of-the-Art Binghamton University  | Digital Additive Manufacturing of Electronic Devices: Inkjet, Aerosol, Dispensing, EHD printing and beyond Celanese | Screen Printing, Curing, and Testing/Post-Processing: Technologies, Practice, State-of-the Art BotFactory | An Analysis of AME and its readiness to serve low-volume PCB manufacturing Holst Centre  | Wearables for Healthcare Applications Berlin 2023 | Watch Now Kundisch GmbH & Co. KG  | HMIs with Integrated Smart Functions Holst Centre  | Sustainable Electronics: Understanding and Analysing Sustainability Aspects of Printed Electronics MacDermid Alpha  | Interconnect technologies for flexible hybrid stretchable electronics: from conductive adhesives to low-T solder Elantas  | Processing Functional Screen Printing Pastes Scrona  | Electrohydrodynamic Printing and how to Scale it towards Economics Neotech AMT GmbH  | 3D Printed Electronics Stuttgart Media University | Screen Printed Batteries JOANNEUM RESEARCH  | R2R - UV Nanoimprint Lithography - Nano goes Macro for innovative use cases Eastman Kodak  | Technologies for High-Resolution R2R Manufacturing TactoTek  | 3D Structural In-Mold Electronics: New Design Freedom and New Design Rules Holst Centre  | Wearable Sensors for Healthcare Applications Molex  | Navigating the Market Landscape: Qualifying Ideas and Overcoming Barriers in Printed Electronics Eindhoven 2022 | Watch Now Asada Mesh  | Advanced Functional Screen Printing: Advances and Techniques for Ultra Fineline Printing Copy Notion System s | Industrial Inkjet Printing Holst Centre  | Wearable Sensors for Healthcare Applications Fraunhofer Institute for Applied Polymer Research  | Introduction to Solution-Processed Light-Emitting Materials: Quantum Dots, OLEDs Holst Centre | Introduction to LIFT (Laser Induced Forward Transfer): Technology and Challenges CPI  | Flexible Hybrid Electronics Manufacture – An Overview Innovation Lab  | The Art of Roll-2-Roll Printing Copprint  | Copper Inks Usage, Formulations and Applications

Author: Thibaut Soulestin, PhD; Senior Application Engineer, Henkel Adhesive Technologies - Printed Electronics;  thibaut.soulestin@henkel.com Henkel Adhesive Technologies holds leading market positions worldwide in the industrial and consumer business. As a global leader in the adhesives, sealants, and functional coatings markets, Henkel has developed a large material portfolio of LOCTITE® conductive inks and coatings suitable for printing electronic circuitry, that is thin, lightweight and flexible. The LOCTITE® Printed Electronics portfolio offers more than 100 different material solutions of which more than 20 are silver inks. Driven by the megatrend of digitalization, printed electronics offer a complementary solution to traditional electronic circuitry, opening new opportunities for electronics integration and miniaturization across industries. To achieve surface integrability, with limited visibility to the human eye, the printing of fine line structures has become increasingly important. To achieve high-performing fine line printed circuitry, it requires conductive inks having fine silver particles and adapted viscosity e.g. LOCTITE® ECI 1006. We are exhibiting! Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.    1. LOCTITE® ECI 1006 Among the large range of Henkel silver inks, LOCTITE® ECI 1006 is specifically developed for fine-line printing, targeting a line width below 150 µm (Figure 1). Fine lines are of particular interest for the development of transparent conductive surfaces, amongst others enabling human-machine interface (HMI) solutions. More precisely transparent capacitive touch sensors enable backlighting for HMI. The better long-term reliability of LOCTITE® ECI 1006 can be an advantage compared to alternative materials on the market, e.g. PEDOT: PSS inks. In addition, LOCTITE® ECI 1006 can heat up to 150°C, without performance degradation, allowing rapid heating. This makes it an interesting material solution for visible or radar-transparent heaters with printed fine lines. The heater power can be adjusted by the design of the fine lines. De-icing of advanced driving assistance systems, ADAS, is a good application example. LOCTITE® ECI 1006 is specifically formulated with fine silver particles to avoid clogging of the screen and provide homogeneous electrical contact, even for very fine lines below 50 µm width. This ink also shows high viscosity and thixotropic index to reduce the spreading of the ink. Figure 1. Example of a 1 kg LOCTITE® silver ink The dry ink layer shows good adhesion onto a large range of substrates after 1000 hours at 85°C and 85 %RH, even on difficult substrates such as copper, or ITO. Beyond good adhesion on ITO LOCTITE® ECI 1006 offers low contact resistance, making it particularly suitable for busbars on transparent ITO films. To meet the growing demand for hybrid electronics and components attached onto flexible substrates, this ink is compatible with low-temperature solder Sn42Bi58 paste; and electrically conductive adhesives such as Henkel LOCTITE® ABLESTIK CE 3104WXL or LOCTITE® ABLESTIK 2030SC. Table 1. Typical Properties of LOCTITE® ECI 1006 2. Printing Trials with LOCTITE® ECI 1006 2.1 Equipment Stainless steel screens with thin wires and high mesh count are mandatory to achieve good printing quality. It is the most important parameter. For a test study, a 640-15 stainless steel mesh from Asada was selected. Thermotropic liquid crystal polymer monofilament mesh, also known as V-screenTM, are a good alternative. Figure 2 shows the test design with line width from 100 µm down to 30 µm width with different spacing and orientation to see the influence of print direction and ink spreading. Figure 2. Fine line test screen design A thin and low roughness emulsion over mesh, EOM, is also required to keep the good printing definition, below 10 µm with a roughness below 2 µm, is recommended. A thicker EOM will impede the ink release, resulting is pinholes or line breaks. The emulsion AZOCOL® Z 177 FL with release agent KIWOMIX® RA 1750. EOM 8 µm from Kissel+Wolf. The release agent improves the paste releases from the screen (Figure 3). Figure 3. Emulsion AZOCOL® Z 177 FL with release agent KIWOMIX® RA 1750. EOM 8 µm. After printing, the paste is fully released from the screen. A Carbon S 75° 8 mm squeegee from RKS was chosen to provide constant printing quality over the entire trial without mechanical changes of the squeegee behaviour. Standard untreated polyester substrate, CUS5 125 µm thick from Mc Dermid, was selected. The substrate surface energy can play a significant role in the printing quality, especially for the ink spreading after printing. Using a standard substrate demonstrates that with the right ink and printing equipment, fine silver lines, below 50 µm, are already possible. LOCTITE® ECIs 1006 was used un-diluted and diluted with 2 wt% of DBE solvent, CAS number: 95481-62-2. The ink is mixed with a propeller mixer, at low speed, 300 rpm. Dilution up to 10 wt%, by 1 wt% increments, is possible to balance printability versus ink spreading. Printing trials were carried out in Henkel Inspiration Center Düsseldorf, ICD in a standard lab environment. For reliable quality production, dust-controlled rooms or even clean rooms are highly recommended. We are speaking! Join us at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.   2.2 Visual Inspection Figure 4 shows the microscope images of 30 µm and 75 µm lines width with un-diluted and 2 wt% diluted ink. 75 µm lines with un-diluted ink have good edge quality with very low spreading. At 30 µm, due to the high ink viscosity and the screen mesh, the edges are wavy and line breaks are observed. 2 wt% dilution with DBE solvent improved the printability and much better line edges are observed without lines breaks. This improvement is coming with a larger ink spreading as observed for the 75 µm line width. Figure 4. Left column: Un-diluted LOCTITE® ECI 1006 ink, Right column: 2 wt% diluted. Top row: 30 µm line width design, Bottom row: 75 µm line width design. Line breaks may be caused by the rough surface of the mesh and high ink viscosity. But they can also result from external pollution such as dust. Figure 5 shows a line break of a 50 µl line width despite good printing quality. This break is likely due to screen blockage by external pollution. Thus, it is important to produce in a dust-controlled environment, and clean room conditions to avoid contaminations resulting in line breaks or shortcuts between lines with narrow spacing. Figure 5. Microscope image of 50 µm line width printed with undiluted LOCTITE® ECI 1006. The mesh structure is visible on the edges of the printed tracks but also on the surface. Figure 6 gives an overview of interferometer measurements on fines lines with undiluted LOCTITE® ECI 1006. At low width, below 30 µm, the ink is barely printed on the substrate. For the 50 µm lines, even if the edges are regular (Figure 5), the surface roughness is important with hills and valleys ranging from 1 µm up to 9 µm thick. This roughness is strongly related to the screen mesh but can also be mitigated by diluting the ink to favour ink flow. Figure 6. Interferometer images of 20, 25, 30, 40, and 50 µm lines width printed with undiluted LOCTITE® ECI 1006. Printed track surface homogeneity and edge regularity have a direct influence on the final printed track resistance. The valley and narrower sections create local higher resistive points resulting in higher track resistance. Figure 7 summarises the track resistance (R) normalized to the track shape (Nsq = length/width), called Square Resistance, in mOhm/sq. For standard silver ink printing with a line width in the 0.5 to 20 mm range, the square resistance on tracks on one print is constant, as the thickness is the same for all the tracks and the edges have no influence. For fine lines, the influence of edges and roughness is clearly visible. 20 µm tracks are not conductive. The square resistance for the 30 to 50 µm lines is above the expected value because of a narrower section of the tracks. As of 75 µm, the square resistance is constant indicating negligible influence of the edges and roughness. The square resistance of the tracks printed with undiluted ink is higher as the edge quality is lower. To achieve good quality 50 µm tracks, a dilution higher than 2 wt%, closer to 4 wt%, would be required. Figure 7. Square resistance of undiluted and 2 wt% diluted LOCTITE® ECI 1006 for different line widths Advanced microscopic equipment is thus not needed to check the printing quality of the tracks. By simply monitoring the square resistance, it is possible to assess the edge quality and even more thickness homogeneity. Homogenous tracks are important for fine-line heater applications to avoid local hot spots leading to local burns and loss of heater performance. 3. Conclusion Successful fine line printing is a subtle balance between ink, equipment, and processing. Different LOCTITE® inks can be used for fines lines such as LOCTITE® ECI 1010, LOCTITE ECI® 1011 or LOCTITE® ECI 1006. The later features the best combination of fine silver particles, adapted viscosity, good reliability, and adhesion to a wide range of substrates. Aside the ink, the screen is the most important parameter for successfully printing fine lines. Therefore, it is highly recommended to seek advice and alignment with your screen supplier before starting the printing. To ensure you achieve your printing goals, the Henkel Printed Electronics team can help you choose the right ink for your application requirements and introduce you to trusted industry partners. Connect with our printed electronics experts and learn more about Henkels established portfolio of conductive inks and coatings: printed.electronics@henkel.com . 4. Acknowledgements Thank you; to Asada Mesh for supplying the stainless-steel mesh; Kissel+Wolf for supplying the screens with the emulsions, and RKS for the carbon squeegees. Thank you all for the in-depth and fruitful technical discussions.

Author: Dr. Lena Reinke | lena.reinke@panacol.de Perovskite-based (PSC) and organic photovoltaic (OPV) cells represent a promising frontier in renewable energy generation technologies due to their potential for lightweight, flexible and potentially cost-effective solar power generation. However one of the critical challenges in the commercialization and long-term reliability of OPV cells is their encapsulation. Effective encapsulation protects the delicate photoactive materials from environmental factors such as moisture, oxygen and mechanical stress. Adhesives play a crucial role in this encapsulation process, offering not only mechanical stability but also environmental protection. This article focuses on the various types of adhesives used in the encapsulation of OPV or PSC cells. We are exhibiting! Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024. Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D. Encapsulation adhesives for OPV or PSC cells must meet several stringent criteria: Moisture and Oxygen Barrier: As the active materials are sensitive towards humidity and/or oxygen, the adhesive should therefore provide good barrier properties to prevent a degradation caused by moisture or oxygen ingress. The adhesive barrier properties can be tuned using to different strategies. One can either use quite hydrophobic raw materials to chemically prevent the ingress of water molecules or the cross-linking properties of some multifunctional components can build up a dense polymer network after curing so that the water ingress is blocked mechanically. UV stability: The adhesive should also withstand prolonged exposure to sunlight without turning yellowish or getting brittle. This is especially important for PV applications that will be used outside. Adhesion strength: It is important to ensure the mechanical integrity of the devices. Therefore, the adhesive needs to firmly bond the encapsulant material to the PV cell layers. Within initial tests, we check the adhesive performance by conducting T-Peel tests. Often it is very helpful to use a pretreatment technology such as corona or plasma to ensure sufficient surface energy and thus an enhanced T-Peel strength. Compatibility: While sufficient adhesion strength is crucial, we also need to address the compatibility between the adhesive and the active layers. While an effective binding towards plastic substrates can often be provided by using monomeric raw materials, those can be quite harmful for the sensitive photoactive materials especially if a pronounced polarity is present. To overcome this issue, chemists need to balance out the ratio between oligomeric and monomeric compounds. We are speaking! Join us at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.   For the encapsulation process, there are several types of adhesives that can be interesting. Epoxy-based formulations are widely used as they typically bring chemical resistance and thermal stability. This is due to the durable bonds that are formed during the polymerization process and accompanied by significantly improved barrier properties. Acrylic-type adhesives are also commonly used, especially if it comes to more challenging substrates as for example PET. Here, the required flexibility can be achieved more easily as for the usually more rigid epoxies. An additional advantage for acrylic-based adhesives is the typically faster polymerization. As time often is a critical criteria the curing speed should always be taken into consideration. In Table 1 a qualitative comparison between the two adhesive groups is listed. Table 1 Qualitative comparison of the main features of epoxy- and acrylate-based adhesives. It is obvious that for both adhesive types there are advantages and drawbacks. This is caused by the adhesive’s properties influencing each other. The best example is that the barrier properties of a flexible acrylate-based adhesive are often worse in comparison to a highly crosslinked material. On the other hand, the flexibility of an adhesive also strongly influences the adhesion properties on flexible substrates positively. Therefore, it is required to balance out the adhesive’s flexibility and barrier properties. Another interesting binding task for adhesives is the contacting of the PV cells. To address this topic, it is possible to use electrically conductive adhesives. Those adhesives typically have the drawback that a deep frozen storage and delivery is required as the metal particles tend to settle down. As the particles block UV light, a photoinduced curing is also not possible often resulting in a slow curing speed and high temperatures that are required for curing. With Elecolit 3648, Panacol has developed an adhesive that can be cured under relatively mild conditions (see table 2). The comparatively low viscosity of about 10.000 – 15.000 mPas (at shear rate 10, 25 °C) allows it to be dispensed easily. Table 2 Possible curing parameters for Elecolit 3648. The previously mentioned adhesive properties are complemented by the adhesives' impressive flexibility which allows Elecolit 3648 to be used within flexible PV devices. Join us at the flagship TechBlick event in Berlin on 23-24 October 2024. Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.

TechBlick The Future of Electronics RESHAPED - Why You Should Join Us We have prepared a world-class agenda for you, featuring over 70 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased. In this article, we discuss the theme of volume manufacturing with printed electronics highlighting talks, masterclasses and tours from the likes of Flexoo, Avery Dennison Smartrac, SPGPrints, db-Matik, Beckermus Technologies, Printed Electronics Limited, Voltera, Tracxon, ImageXpert, Fraunhofer IZM, Quantica, Inuru, ScreenTec, etc In a previous article, we have already highlighted some of the talks focused on wearable, bio, and/or medical sensors as well as on digital and 3D additive electronics. In future articles, we will highlight more contributions on this theme as well as other key themes such as sustainable electronics, materials innovations, additive and 3D electronics, wearables and electronic textiles, medical electronics, photovoltaics, packaging, novel materials, lighting applications, etc. Stay tuned! Flexoo will outline their ability to offer mass customization as well as mass production with a specific focus on smart sensors and labels. Flexoo - a spin-off from InnovationLab GmbH with the direct acquisition of Heidelberg Printed Electronics GmbH - has created unique capabilities, covering all scales of R2R production from development to prototyping, to small volume production, to extremely large volume. In this talk, you can learn how this one-stop-shop approach enables the development and production of products with printed sensors, printed circuits, printed antennas, printed heaters, and beyond. SPGPrints will take you through the journey of scaling up Printed Electronics production along the 3 C’s of de-risking industrialized production using real-life customer cases: Cost, Capacity, and Certainty. They will also cover critical technical and application-design considerations for mass production, including how to balance pattern design, inks, substrates, and production methods. Furthermore, they will discuss how rotary screen printing enables cost-effective and high-throughput manufacturing with superb resolution and excellent thickness control, and they will offer a detailed cost comparison of flat versus rotary screen printing. Avery Dennison Smartrac will outline their developments in green printing in the digital landscape, showing how their approach can scale to mass production. This is an excellent development, combining the long-standing expertise of Avery Dennison Smartrac in R2R production of hybrid electronics with green additive manufacturing techniques. Beckermus Technologies will outline the key challenges of interconnections between chips and flex substrates, especially in R2R hybrid electronic manufacturing. This is a critical technological step in enabling roll-to-roll manufacturing of flexible hybrid electronics. Beckermus Technologies will offer insights based on its years of real-time FHE manufacturing experience, discussing different interconnect material and process technologies. Voltera will present the latest developments using their unique digital printer, focusing on the use case of multi-layered printed battery applications. While this machine is not a volume manufacturing machine, it could play an important role in accelerating the design-to-fabrication process. This is because it enables digital and software-controlled development and prototyping of complex multilayer devices using high-viscosity pastes, which could then be transitioned directly to mass production techniques like screen printing. This is significant because many other digital prototyping techniques rely on inkjet and are thus limited to low-viscosity inks with nanomaterials that cannot be screen printed. Printed Electronics Limited (PEL) will share their unique experiences in prototyping and small production (10 pcs to 2500 pcs) across the resolution spectrum. PEL’s unique capabilities cover the entire resolution spectrum from 1 µm to 1 mm. Their capabilities include superfine inkjet (SIJ), aerosol, screen printing, inkjet, and viscous jet deposition. Even with their screen printers (Microtec printers), they can achieve down to 30 µm linewidths with <15 µm print-to-print accuracy. Furthermore, they can print between 2-14 layers per device, including through-hole printing. db-Matik will present their capabilities, outlining their full turnkey solutions for electronic manufacturing on flexible substrates. This includes printing as well as assembly lines, covering circuit printing as well as component placement on films. Additionally, their solutions offer testing as well as singulation. They are an excellent partner for anyone looking to set up or expand a printed electronics production line. Expert-Led Masterclasses The event also includes fantastic masterclasses dedicated to manufacturing. ScreenTec will discuss how to manufacture wearable sensors. ScreenTec is a well-established printing house with deep expertise and experience in wearable sensor manufacturing. Beckermus Technologies will hold a class on interconnect technologies for flexible hybrid electronics, covering key technologies such as various solders and conductive adhesives. This is a must-attend class for anyone interested in placing components onto films in flexible hybrid electronics manufacturing. ImageXpert will hold a class showing how to optimize an inkjet printing process for electronic or functional manufacturing. This is a must-attend class for anyone wishing to develop and/or manufacture with inkjet printing. TracXon will discuss roll-to-roll (R2R) flexible hybrid electronics manufacturing, covering all steps from R2R printing to R2R assembly and testing. TracXon has robust expertise here, given their own work with R2R screen printing, R2R sintering/curing, and assembly. Printed Electronics Ltd will hold a class covering all digital additive electronics manufacturing tools, from inkjet to aerosol to EHD printing and dispensing, and beyond. This is an excellent overview class for those wishing to apply digital methods to develop or manufacture electronics. Tours We also have several tours related to the theme of manufacturing. Fraunhofer IZM: This is an extremely popular tour, showcasing Fraunhofer IZM’s deep and wide capabilities and expertise in all aspects of advanced PCB and assembly technology, as well as in hybrid soft electronics, integrating electronics with soft substrates such as textiles. Inuru: This is a unique tour showcasing the world’s first and only printed OLED lighting factory. This is possibly the only facility worldwide dedicated to inkjet printing of thin and flexible OLED lighting. Quantica GmbH: Here, you can see the workshop and machinery of Quantica, who offers jetting heads for high-viscosity digital printing of electronics. This is a much-needed technology that promises to break the limits of inkjet printing, making digital functional printing finally a versatile production method. Exhibition Of course, the exhibition is the key place where you can find partners across the entire value chain, including equipment manufacturers, ink and paste formulators, printing houses, and more. This is the place to visit if you intend to develop, prototype, or manufacture with printed and/or flexible hybrid electronics. There will be over 80 exhibitors from around the world. You can see the floor plan and learn about the exhibitors here .

In this newsletter, you can learn about the following technologies. We will have the opportunity to download the full slides. ISC Konstanz - Screen-printed Cu-pastes for highly efficient back-contact silicon solar cells Oxford Suzhou - Efficient and Stable Inverted Perovskite Solar Cell with modified Al as a Cathode OE Technologies - Roll2Roll High-Volume Manufacturing of OPVs Perovskia Solar AG - Perovskite solar cells for low-light applications   The Future of Electronics RESHAPED Europe is the flagship TechBlick event. This event will take place at the Estrel Hotel and Convention Center (ECC) in Berlin on 23-24 October 2024 . Explore the preliminary agenda here. 1. Screen-printed Cu-pastes for highly efficient back-contact silicon solar cells ISC Konstanz  |  March 2022 Screen printed Cu-pastes for high efficient back-contact silicon solar cells? In this slide deck you can learn about: ✅Accelerated growth of photovoltaics ✅Market growth of PVs and impact on silver consumption ✅Benefits of Copper vs Silver ✅Requirements for Cu based metallization ✅Properties of copper ink from Copprint ✅Back contact solar cells: ISC’s ZEBRA cell ✅Replacement of Bus Bars in ZEBRA ✅Line resistance Cu busbars ✅Results cell IV characteristic ✅Peel force results: soldering and ECA ✅Climate chamber tests ✅Thermal cycling results ✅Damp heat results ✅Conclusion and Outlook Download Presentation Slides 2. Efficient and Stable Inverted Perovskite Solar Cell with modified Al as a Cathode Oxford Suzhou  |  JAN 2024 Efficient and Stable Inverted Perovskite Solar Cell with modified Al as a Cathode? In this slide deck you will learn about: ✅Inverted Perovskite Solar Cells ✅Inverted Perovskite Solar Cells with Al as cathode ✅Characterization of TOASiW12/Al interface ✅Performance of the inverted PVSCs ✅Air stability the inverted PVSCs ✅Chemical reactions between perovskite and Al ✅In-situ optical microscope images ✅Conclusion Download Presentation Slides 3. Roll2Roll High-Volume Manufacturing of OPVs OE Technologies  |  JAN 2024 Roll2Roll High-Volume Manufacturing of OPVs? In this slide deck , you can learn about ✅R2R process flow ✅R2R Printed OPVs | Smart Manufacturing ✅Automated Coating Station & Vision System ✅In-Line Metrology & Quality Control tools ✅Design and Result Collection ✅OET’s R2R Printed OPVs Manufacturing ✅World’s 1st R2R Automated Manufacturing Line for IPVs (Integrated OPVs) ✅BI(O)PV [Building Integrated OPV] PILOT DEMONSTRATION SITES ✅Agri(O)PV PILOT DEMONSTRATION SITES ✅VI (O)PV PILOT DEMONSTRATION SITES ✅Towards GigaFactory Download Presentation Slides 4. Perovskite solar cells for low-light applications Perovskia Solar AG  |  DEC 2022 Inkjet printed perovskite solar cells? In these slides you can learn from: ✅The Technology ✅Indoor energy harvesting ✅Design Freedom ✅World's first self-charging health tracker ✅Electrical specifications and data ✅Technical developments ✅Damp heat test ✅Sun illumination test including under 11K Lux ✅Production facility Download Presentation Slides

Why You Should Join TechBlick's The Future of Electronics RESHAPED? We have prepared a world-class agenda for you, featuring over 70 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased in the program. In this article, we discuss the theme of Smart Surfaces and Sensors  including  the automotive and human-machine interface sections. highlighting talks, masterclasses, and tours from the likes of Forvia, Momentive and BSC Computer, Motherson Innovations, Global Access Diagnostics (GADx), Datwyler, Würth Elektronik Group, Metafas, Holst Centre, and Arkema and KEMET. In a previous article, we already highlighted talks focused on wearable, bio, and/or medical sensors.   In future articles, we will highlight more contributions on this theme as well as other key themes such as sustainable electronics, materials innovations, additive and 3D electronics, wearables and electronic textiles, medical electronics, photovoltaics, packaging, novel materials, lighting applications, etc. Stay tuned! Forvia  - a global automotive supplier - will join us to give an invited keynote talk, outlining their strategy for automotive interiors using printed electronics including smart surfaces. The presentation will cover the specific use cases under development, and will zoom in on specific applications for interior lighting, which is currently the main focus for smart light and surface lighting.  Furthermore, some insights on exterior applications will be shared. Würth Elektronik Group  will outline the state of the art of the industrial stretchable PCBs, which is a novel method for 3D form copper-based stretchable PCBs to create smart surfaces with 3D shapes and with bulk-like properties and good solderability. This technique is a direct alternative to ink-based in-mold electronics (IME). Metafas  will outline its progress on InMold Electronics. This is a promising development as this printed electronics business evolves from screen-printed membrane switches towards more complex printed systems like complex IME products. Holst Centre  will also join us as a masterclass instructor, giving a class on InMold Electronics technology. This class not only covers the key aspects of IME but also uniquely focuses on life cycle analysis (LCA) as well as end of life (EOL) of IME. These are critical themes as one perception of IME is that the embedded electronics can not be readily recycled or recovered. Momentive and BSC Computer will present their unique DEA or Dielectric Elastomer Actuator technology which are capable of replacing small motor-gear units. These DEAs consist of stacks of thousands of individual silicone layers with conductive coatings. The motion dynamics depend heavily on the silicone base material used and the dimensions of the stacks. This talk not only introduces the technology, how it is made and how it must be run and integrated, but also showcases applications including ones that will soon be launched. Datwyler will also present on how to make elastomers smart either by embedding conventional active electronics or using the elastomers themselves as sensors and actuators. Here you will learn about the possibilities of technical solutions for sensing and actuation, and their needed design environments and read-out and analytics, as well as applications. You will see examples with printed and integrated electronics, magnetic active polymers and use of elastomers for bio signal monitoring. Arkema and KEMET will join as masterclass instructors, giving a class on electroactive polymer sensors and actuators. In this must-attend class, the participants will learn about the different types of EAP, the unique property of EAPs with a specific focus on ferroelectric ones, their deposition and processing conditions as well as many applications in flexible electronics from AR/VR to medicals Motherson Innovations will join us to discuss their developments with printed electronics, covering automotive (its main business) as well as other applications. This talk will cover applications developments such as integrated touch sensor, heated toilet seats, heated armrest, integrated ambient lighting, transparent 2D sensors for interactive lighting, printed lighting, and others. Marquardt GmbH - a mechatronic specialist with over a billion EUR revenue - will present its insights on what opportunities exist for printed electronics also beyond cost optimisation and what obstacles are still to be overcome. Marquardt is well placed to assess applicability of printed electronics versus conventional solutions in many fields as it can draw up ten years of dedicated experience and as it is a series supplier in automotive (control elements, vehicle access and driver authorization, battery management systems), white goods and power tools as well as off-road and agriculture sectors.

Author: Mr Naveen Balla, info@hamamatsu.de The production of printed electronics represents a transformative approach to manufacturing electronic devices. Switching from complex technologies like etching or lithography to a printing process significantly simplifies production, offering a cost-effective, versatile, and straightforward pathway to fabricating electronic components on various substrates. As a result, printed electronics are used in a wide range of devices, including flexible displays, thin-film transistors, sensors, and photovoltaic cells. While already common in various industries, production equipment for printed electronics still has room for improvement to optimize manufacturing efficiency. One important aspect of this optimization, especially when using metal nanoparticle inks, is the sintering process. The sintering step includes fusing the metal nanoparticles in ink ensuring the required low resistivity of the finished circuits. For this task, heating ovens, NIR emitters, and broadband flash lamps are established technologies, but they suffer from drawbacks that limit the speed or efficiency of production. In this article, we present five aspects of printing equipment that can be improved by switching to laser sintering. Table 1: Comparison of different sintering methods We are exhibiting! Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024. Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D. 1. Reducing the footprint of the printing machine Furnaces for sintering printed electronics can be large, particularly for serial production. As the sintering process in the oven takes a few to tens of minutes, it typically does not match the production rate of the preceding printing process. To maintain high production rates, more furnaces or long conveyors are required, resulting in a large machine footprint. Laser sintering offers a solution for developing more compact machines. Since the sintering process using NIR laser takes only milliseconds, it can be performed on the conveyor directly after printing, making roll-to-roll processes possible. For machines with limited space, laser sintering provides even more flexibility. As the laser light is coupled into a fibre, it can be flexibly guided over longer distances, allowing separation of the light output from the laser source and its electronics. This minimizes the space required at the light output, enabling smaller sintering machines for confined production areas. Laser sintering is the process where laser is used to heat metal nano/ micro particles to the point that they fuse without completely melting. 2. Increase production speed Switching from a furnace-based sintering process to laser sintering reduces space requirements and helps increase production speed. While the sintering process in a hot air oven takes a few to tens of minutes, NIR laser light sinters the metal ink within milliseconds. This allows high printing speeds and ensures that the sintering step is no longer the production bottleneck. Laser sintering significantly enhances production speed due to the easily scalable laser power, which maintains precise focus with line optics. Depending on the ink and substrate, laser technology allows for speeds of several hundred millimeters per second in roll-to-roll production, substantially increasing output rates. Example of Hamamatsu's SPOLD® laser sintering of conductive inks. 3. Optimizing energy efficiency Energy efficiency is now one of the most important aspects of any production process. Minimizing energy consumption is essential to meet sustainability goals and to reduce production costs, given rising energy prices. The production of printed electronics involves many energy-intensive processes. One example is the sintering step, which requires intense heating to achieve the desired conductivity of the ink, often exceeding 100°C, depending on the nanoparticles. It is an energy-intensive process with significant production costs. Large ovens, commonly used for this process, must heat both the part and the air inside the oven to the target temperature, consuming substantial amounts of power, often 60kW or more. Alternative sintering technologies, such as photonic sintering, also demand considerable power. For instance, flash lamps used during a roll-to-roll process require 5kW of electrical power or more. Laser sintering offers a more energy-efficient solution, due to its high conversion efficiency from electrical power to light power and excellent conversion rate. Typical laser sources for laser sintering, such as the Hamamatsu SPOLD® [1,2] consume around 1kW, while still enabling fast roll-to-roll production. This improved efficiency can significantly reduce production costs over the lifetime of a production machine. Table 2: Comparison of different sintering temperatures for different nanoparticle inks on glass substrates.[3] We are speaking! Join us at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.   4. Enabling the use of thermo-sensitive materials One of the significant advantages of printed electronics is the versatility of substrates, enabling electronics to be integrated into various materials like packaging or clothing. However, high sintering temperatures, typically around 200°C for materials like silver nanoparticles, limit the substrates that can be used. For instance, plastics such as polyethylene (PE) begin to soften at temperatures above 70°C, making it impractical to sinter them in furnaces operating at 200°C or higher. Laser sintering provides the solution. As ink and substrates have different absorption properties, it is possible to select a wavelength where the light is only absorbed in the ink while the substrate remains transparent. As a result, only the ink is heated to the required sintering temperature while the substrate remains unaffected. This allows thermo-sensitive materials, such as plastic foils, to be used, which is advantageous for the packaging industry. However, heat dissipation from the ink into the substrate can still indirectly heat and damage it. Therefore, it is essential to tailor the heating illumination to the properties of the materials. Laser sintering has many advantages over photonic sintering using flash lamps as the optimum wavelengths can be chosen depending on the application. The Hamamatsu SPOLD®, for example, is available at 940nm (optional 808nm), minimizing substrate heating compared to the broader spectrum of tungsten lamps. The laser also offers more precise control of power compared to flash lamps, allowing fine adjustment to stay below the melting temperature of the substrate. This precise control further reduces potential substrate damage, crucial when printing on highly thermo-sensitive materials like PET. Hamamatsu's LD irradiation light source (SPOLD®) 5. Reducing ink costs In addition to the flexibility of substrates, one of the significant advantages of printed electronics is the low production cost. Laser sintering can further reduce costs by switching to less expensive inks. Due to the silver nanoparticles dissolved in the ink, it becomes quite an expensive consumable. Indeed, cheaper alternatives, like copper or aluminium offer similar conductivity values but require different sintering parameters to find the optimum conductivity, strength, and adhesion results. For this optimization, the flexibility of laser sintering is beneficial. Hamamatsu collaborates with several ink manufacturers worldwide to support manufacturers when switching ink materials. Together, they test several micro and nano ink formulations to find their optimum sintering parameters, giving customers a head start when switching to cheaper inks. Laser Sintering increases productivity Switching to laser sintering can significantly impact the productivity of printed electronics production. The laser adds the necessary flexibility to your process and enables the optimization of important parameters like resistivity, density, and adhesion by choosing the optimum ink type, laser power, or conveyor belt speed. Application tests are essential to maximize this increase in productivity. Hamamatsu Photonics supports customers with dedicated application engineers who conduct sintering tests to identify the optimum set of parameters. This simplifies the transition to new laser sintering technology and ensures customers get the most out of their printed electronics production. For more information on our SPOLD® device or on this topic, please contact: info@hamamatsu.de References [1] Hamamatsu Photonics, LD irradiation light sources (SPOLD®): www.hamamatsu.com/eu/en/product/lasers/applied-products-of-semiconductor-lasers [2] Hamamatsu Photonics, "Weld, Solder, Cure or Sinter with SPOLD®":   www.youtube.com/watch?v=I0sLZBR9u_I [3] A Review on Printed Electronics, 2021: Fabrication Methods, Inks, Substrates, Applications and Environmental Impacts: doi.org/10.3390/jmmp5030089 Save the Date! The Future of Electronics RESHAPED 2025 | USA | Europe

25 & 26 Sept 2024 | High Tech Campus, Eindhoven, Netherlands Introducing the Program - MicroLED and AR/VR Market Forecasts, Technology Roadmap, Value Chain Analysis, and Strategies MicroLED Connect is the world's first dedicated MicroLED conference and exhibition. We have put together a fantastic world-class program of talks, masterclass, exhibitors, and company tours, featuring the likes of Google, Meta, TCL CSOT, Continental, GlobalFoundries, Konica Minolta, Toray Engineering, Coherent, Applied Materials, Aixtron, and many others. In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased in the program. Here, we discuss the theme of MicroLED and AR/VR Market Forecasts, Technology Roadmap, Value Chain Analysis, and Strategies , highlighting talks, masterclasses, and tours from the likes of Yole, Omdia, Hendy Consulting, and UBI Research. The microLED industry is backed by the largest companies in the display industry, and has the support of the world's consumer electronics industry. But the technology is still at an early stage, and the road to success is not yet clear. MicroLED-Connect will present a great opportunity to understand the current status of the industry, learn the different roadmaps, understand the key application areas and what the near- and far-future holds for microLEDs. Yole Intelligence: They will present a talk on MicroLED Status and Roadmap, outlining the market, the value chain, and emerging applications as well as segmented and detailed market forecasts. Yole is one of the best analyst groups in the field and can thus deliver deep insight into technology roadmap and market forecasts Omdia:  In one of the closing keynotes, Jerry Kang from Omdia will join us onsite to offer a MicroLED industry update. He will offer his analysis of the state of the industry, outlining key challenges and offering detailed market forecasts segmented by technology, application, and process. Omdia is also a key reference point in the display industry, with many in the value chain relying on their information, analysis and insights to develop their go-to-market as well as technology strategies in the display sector. Masterclass UBI Research: They will instruct a masterclass on AR and VR technologies, reviewing the key technologies, applications and market trends. UBI Research is a well-established and highly respected Korean market research firm in the display industry with excellent access to the key players in the display value chain. This is a superb opportunity to learn the latest on AR/VR technologies. Hendy Consulting: Ian Hendy is one of the best regarded consultants in the display industry, uniquely offering strategic outlooks on technology and market developments. He will offer an insightful analysis of the competitiveness of MicroLEDs vs both QLED and QDEL. He will outline how one can track market developments and consider technology breakthroughs required to enable the required price reductions. This is an excellent opportunity to learn from and engage with one of the best consultants in the field.