Inkjet Printing For Applications With Small Feature Sizes

The technology for integrating dies is an important enabler for the realization of thin applications in flexible hybrid electronics (FHE). Market needs are in making applications with ever smaller feature sizes. Therefore, we have developed an approach for micro assembly of thin and compact devices using interconnections made with inkjet printing.

Challenges for the realization of advanced applications are in the seamless and invisible integration of multiple components, such as ICs, passive components, sensors and LEDs, in an ever smaller space. There is a market need for making thinner devices, for example for applications in in-mold electronics or smart glass. There also is a need to make devices with smaller lateral dimensions for enabling the integration of more complex components. For example, for offering more advanced functionalities more advanced components will be needed. Such components typically have a larger number of interconnections at a finer pitch, which causes a need for thinner interconnections.

We have investigated how the processes for micro assembly with inkjet printed interconnections, used like wirebonds, can be optimized for realizing a scale reduction. With the integration of ultra-thin bare dies, demonstrators could be made with a total heights down to 0.1 mm. The presentation will share the highlights from this investigation, with a perspective on the opportunities that can be realized using the results from this work.