3D printed and hybrid electronics durability under aeronautic conditions

Sensor and electronic integration on aircraft structures enables real time monitoring of structural loads and environmental parameters such as temperature and pressure. The direct integration on composite structures without the need of conventional housings, connectors and cabling reduces weight, complexity and installation effort. We have investigated approaches based on flexible hybrid electronics (FHE) technology with electronic devices being embedded in thermoplastic polyurethane (TPU) foils and these functionalized foils being integrated on aeronautic composite coupons. Alternatively, similar structures have been fabricated using Additively Manufactured Electronics (AME). So far, only limited information was available on the durability of such AME structures. The talk will cover an overview on potential aeronautic applications, manufacturing of our test structures and results of the extensive durability tests of the FHE-based structures as well as test results on the devices made by AME.