Hybrid Microfabrication by 3D printing and subsequent Coating for Electronics and Radio-Frequency Applications
The Future of Electronics RESHAPED 2024 Berlin
22 October 2024
Berlin, Germany
Estrel
Additive manufacturing technologies with precision and resolution on the micrometer scale (micro AM) today are realistically being looked at as viable production technologies, and are no longer the expensive and slow processes of a decade ago. If properly used, the design freedom of micro AM allows of higher miniaturization, functional integration, better performance, or reduced size, weight and power consumption of parts and components. However, most micro AM technologies work with photopolymers which lack certain functionalities. Combining micro AM-derived parts with coating technologies for non-polymer materials that are able to conformally coat 3D substrates is an efficient approach to overcome the lack of functionalities of bare polymer parts. It brings together the benefits of photopolymer based 3D printing such as precision, repeatability and relatively simple processing with the functionalities which the respective coatings can achieve. This talk will present a process portfolio for depositing thin (<10 µm), conformal, electrically conductive, protective and metallic films on three-dimensional polymer substrates made by micro-AM processes to enhance the functionality of the polymer microstructures and their application in radio-frequency devices and electronics.






