Challenges of interconnections between chips and flex substrates

In this lecture I will give a short intro to bare die chips and their different interfaces to the outer world like mechanical interface, electrical interface, thermal interface and more. Some slides about different technologies of mounting chips to flexible substrates will be presented such as using wire bond, solder and electrical adhesives. In the last part of the lecture I’ll give some daily examples of challenges in implementing these interfaces between the chips and flexible substrates.