Thermal/Light Source Specifications for Sintering

In the current printed electronics landscape, the scalability of printed electronics is constrained by the sources used to sinter material. Currently, thermal ovens and infrared lamps have high temperatures and long processing times, which limits the material choices and slows production significantly.
This talk will focus on the different types of light/thermal sources available on the market (including, Ovens, LEDS, Lamps, and Lasers), and a brief look at the history of these light sources.
Additionally, we will cover the relevant specifications for selecting sources for sintering and curing of printed electronics. In addition to relevant challenges and limitations associated with each source type.
Leveraging strengths and overcoming the weaknesses of the source used for sintering is critical to the expansion and adoption of printed electronics today and into the future. Understanding these parameters is the first step in this journey.