Printed Hybrid Electronics (PHE) Manufacturing: Pathways to Next-Gen Electronics

Additive manufacturing (AM) methods are coming of age and being used to not only fabricate structural and prototype parts but also to fabricate high-quality electronic components and circuits. Direct-write (DW) printing is emerging as one of the more promising AM methods for the fabrication of printed circuitization, printed interconnects, and other printed passive circuit components. These printed hybrid electronics (PHE) fabrication methods provide specific advantages for heterogeneous integration at both the package and board levels, for RF electronics, and for conformal electronics. Examples include: i) rapid prototyping, ii) printed interconnects, and iii) new form factors for integrating electronics directly into structural parts. Such PHE fabrication capabilities will be highlighted primarily in terms of manufacturing methods for next-gen electronics.