A wafers-in wafers-out Micro-LED Platform for AI

This keynote will provide an overview of a highly flexible wafers-in wafers-out micro-LED platform, developed over the last 9 years, that integrates advanced 300mm silicon architecture, GaN-on-Silicon emitters, high-performance quantum dots, and micro-lens arrays—breaking conventional trade-offs between size, brightness, bandwidth density, and power. We’ll explore how this platform scales across a wide array of use cases, and why micro-LEDs are uniquely positioned to drive the next wave of AI product innovation.