Unveiling the Smallest Fountain Pen in the World
The Future of Electronics RESHAPED 2024 USA
12 June 2024
Boston, USA
UMass Boston
The future is being shaped by the rapid advancement of microelectronics. However, the design and manufacturing of these intricate components pose significant challenges due to their small size and complex assembly process. To overcome these obstacles, Hummink offers an innovative solution called HPCAP (High-Precision Capillary Printing) technology. This cutting-edge technology allows for the direct deposition of materials at both the micron and sub-micron scales using any type of material and on any substrates. By utilizing Hummink's AFM (Atomic Force Microscopy) based technology, the complex additive manufacturing process for microelectronics is streamlined into a single-step procedure. In this presentation, we will explain the HPACP technology and its vital role in breaking the trade-off between miniaturization and complexity at the microscale. We will also showcase its wide-ranging uses in semiconductor packaging, display technology, biosensors, waveguides, and more.






