An Innovative Deposition Technology For Conductive & Dielectric Materials: Contactless, High Resolution, High Speed

Manufacturers’ very demanding reshoring and miniaturization roadmaps are creating much
higher expectations for material deposition processes. New capabilities are urgently required,
from higher resolution and accuracy to enhanced flexibility in material selection and design, all
in a digital and sustainable form.
The ideal solution is an additive digital material deposition process with industrial productivity
and low cost of ownership
With Continuous Laser Assisted Deposition (CLAD), ioTech brings to reality a capability to
build functional structures by delivering a combination of robust, high-speed, high-resolution,
high-accuracy and multi-material deposition process.
CLAD can be applied to multiple use cases. In this presentation, we will explain the technical
aspect of how laser can transfer material and will introduce the io300 system. We will focus on
the new capabilities that the io300 creates, going well beyond what current technologies can
deliver. The capabilities to be show-cased include 2D & 3D multi-material deposition. In one
example of RDL, a single process combines conductive bridges over dielectric structures.
CLAD and the io300 have been warmly welcomed by the industry, attracting innovation
awards, leading industrial investors, prestigious semiconductor customers and co-funding from
the European Union.
Technical background:
In the CLAD technology, a material evenly coated on a carrier foil, passes under a laser. The laser applies a short burst of energy which releases perfectly consistent drops of material onto the substrate below. The material drops can then be sintered or cured inline. CLAD delivers both high-resolution and a very wide range of geometries and form factors. Fully digital, CLAD requires neither tools such as nozzles or screens nor material reformulation.