top of page

1/6

Hikaru Uno

Global Product Manager

Merck

Japan

* All members of the platform can watch the entire presentation.

Please register to become a member.

Metal-complex silver inks for EMI shielding and conformal metal coatings for semiconductor packaging

Printed, Hybrid, InMold, and 3D Electronics 2022

9 March 2022

Online

TechBlick Platform

Back to Directory

EMI shielding is a critical aspect of semiconductor packaging and chip/wafer manufacturing that ultimately enables OEMs to provide more communication and performance features using less space, weight, and providing more form factors in their products

Watch the 5-minute excerpt from the talk

More presentations from

Merck

Back to Directory

The TechBlick Platform: Why Join?

Onsite Admission

With your Hybrid Individual or Group Pass, you can attend one or more of our world-class conferences and exhibitions around the world, including Electronics RESHAPED USA or Europe, MicroLED Connect, AR/VR Connect, Perovskite Connect, Sustainable Electronics RESHAPED, and more…

Become a Speaker

Become an Exhibitor

bottom of page