A Paradigm Shift in Roll-to-Roll Spatial Atomic Layer Deposition for Perovskite Solar Cell Manufacture
The Future of Electronics RESHAPED 2025
22 October 2025
Berlin, Germany
Estrel
Nowadays, Atomic Layer Deposition (ALD) is an key enabling technology in the semi-conductor manufacturing a.o. because of the atomic scale thickness control and excellent conformality in 3D structures. For large area deposition, particularly in roll-to-roll (R2R) processing, such a temporal ALD reactor is highly incompatible due to the fact that the process is operating at low pressure and exposure of precursor and co-reactant is done sequentially in time. Spatial ALD (s-ALD), however, enables parallel exposure of precursor and co-reactant operating at atmospheric pressure which makes it seamlessly compatible with R2R processing. The paradigm in R2R s-ALD consists of a rotating deposition head with the web transported floating on the process gas in counter direction along the perimeter of the deposition head. We propose a paradigm shift in R2R s-ALD. We have developed a robust R2R s-ALD solution which can operate at 100 times higher web speed. Our R&D tool can be utilized for the development of various functional inter-layers in PSCs. To boost the efficiency of PSCs high quality thin films are prerequisite and our R2R s-ALD tool can offer the highest film quality at flexible (0.05-5 m/s) deposition speeds. Several examples of functional inter-layers in PSCs will be showcased from passivation, charge transport and high performance moisture barrier layers. ᐧ






