XG-Alpha: Exploring Cost-Effective, High-Quality Laser Assembly of MicroLEDs

High-yield and cost-effective microLED assembly processes still face major challenges to solve for successful market adoption by the display and lighting markets. We believe that achieving five-nine (or even six-nine) yield is within reach—enabled by 100% in-line quality control and in-cycle process selectivity for both placement and binning. ITEC has been working together with TNO-Holst to bring two key processes to market: LIFT2.0 for dispensing of interconnect materials and FAST-CT for laser component transfer.