top of page

1/5

John Yundt

Vice President of Sales and Business Development

SunRay Scientific

USA

* All members of the platform can watch the entire presentation.

Please register to become a member.

Advanced interconnect solutions for flexible hybrid electronics

Printed, Hybrid, InMold, and 3D Electronics 2022

8 March 2022

Online

TechBlick Platform

Back to Directory

Watch the 5-minute excerpt from the talk

More presentations from

SunRay Scientific

Back to Directory

The Future of Electronics RESHAPED 2025

21 October 2025

Ultraviolet Light-Cured Anisotropic Conductive Epoxy for Low Cost, High Throughput Electronic Assemblies

John Yundt

Estrel

Berlin, Germany

The Future of Electronics RESHAPED 2024 USA

11 June 2024

Increased Functionality for IoT through Flip Chip Die Attach of Wire-Bondable Chips on Flexible Hybrid Electronics (FHE)

John Yundt

UMass Boston

Boston, USA

The TechBlick Platform: Why Join?

Onsite Admission

With your Hybrid Individual or Group Pass, you can attend one or more of our world-class conferences and exhibitions around the world, including Electronics RESHAPED USA or Europe, MicroLED Connect, AR/VR Connect, Perovskite Connect, Sustainable Electronics RESHAPED, and more…

Become a Speaker

Become an Exhibitor

bottom of page