Towards Sustainable PCBs: Design, Process Efficiency and Material Innovation for a Greener Lifecycle
The Future of Electronics RESHAPED 2025
21 October 2025
Berlin, Germany
Estrel
The electronics industry faces growing pressure to implement sustainable solutions throughout the entire product lifecycle. In printed circuit board (PCB) manufacturing, advanced production technologies and alternative base materials are emerging as key enablers for reducing environmental impact.
This presentation explores the ecological potential of selective solder mask application, a process innovation aimed at minimizing material usage and energy consumption. As part of a dedicated technology-driven research initiative, comprehensive quantitative analyses were conducted to compare conventional and optimized manufacturing workflows. The findings demonstrate significant reductions in energy usage, chemical input, and coating materials—providing a robust foundation for industrial adoption.
In addition, the talk highlights recent advancements in resource-efficient base materials that support new design paradigms and enhance recyclability and circularity. These materials unlock new possibilities for sustainable electronics development.
For PCB layout engineers and hardware developers, these insights offer actionable strategies to embed sustainability into the design process from the outset.






