High Resolution and High Throughput Laser Lithography

High-resolution, high-throughput laser lithography is emerging as a critical technology for bridging the gap between research and industrial adoption in advanced device manufacturing. Leveraging maskless, direct-write flexibility, modern systems integrate multi-beam parallelization, high-NA optics, and precision stage control to deliver deep-sub-micron resolution while maintaining large-area scalability.
These advancements open new opportunities in semiconductor and photonics markets where both speed and fidelity are essential. In microLEDs, laser lithography enables rapid prototyping and high-volume master fabrication for mass transfer processes. In advanced packaging, it supports redistribution layers and through-package vias with fine-pitch accuracy. For photonic components, grayscale lithography extends the platform to 3D topographies such as waveguides and microlens arrays, critical for AR/VR and optical communication systems. Here in this talk, we will go into the details how the parallel maskless laser lithography engines can provide real-time grayscale exposure while providing a deep sub-micron resolution and excellent overlay capabilities for applications in micro-optics, mask making and advanced packaging.
By combining throughput, resolution, and process versatility, next-generation laser lithography provides a cost-effective alternative to mask-based approaches, accelerating innovation from concept to pilot-line production.