Towards integrated CMOS + GaN microdisplays fabricated at wafer scale

Microdisplays for AR/VR headsets are set to usher in a new era of human-machine interactions. These microdisplays are typically manufactured using hybrid integration via chip-to-chip bonding performed using packaging-based technologies. However, the technical barriers to achieving high-throughput and cost-effective mass-manufacturing using these methods has limited the adoption of microdisplays to date.

At nsc, we have taken a different approach to microdisplay manufacturing that involves wafer-scale integration of GaN LEDs and CMOS devices using a truly monolithic solution. By leveraging existing CMOS devices and established back-end-of-line processes along with nsc’s proprietary wafer scale layer transfer techniques, we create microdisplays in a highly scalable and manufacturable process. This enables groundbreaking chip-based display solutions on a commercial scale, which will pave the way for innovative product, system, and software designs.

This is made possible by two key factors: (1) maintaining compatibility with existing silicon fabrication processes and equipment, thus avoiding cost and yield issues associated with advanced packaging solutions; and (2) and capitalizing on the wealth of knowledge amassed by the semiconductor industry over the last 50+ years. This approach facilitates rapid scalability and the adoption of CMOS + GaN microLED chips ideally suited for AR/VR displays in a truly manufacturable and economically advantageous way.