Development of nano copper powder with oxidation-resistant and air stable copper based MOD Paste for Printed Electronics

We develop unique conductive materials for an energy-smart, sustainable world using our core technique. This talk introduces newly developed items, which are oxidation-resistant nano copper powder and MOD (metal-organic decomposition) paste for printed electronics. Our fine copper powder shows uniform size, strong oxidation resistance, and dense sintering near 200℃.

Also, MOD paste consists of MOD ink and its Cu powder to obtain film thickness—from thin lines to thick buses, over 3× typical nano inks—while keeping copper-like conductivity.

During curing, a protective layer forms on Cu, enabling reliable, low-resistance paths for high-current and large-area devices and compact modules. We aim to bring affordable, scalable copper printing to mainstream manufacturing.