Advanced Bonding Technologies for Flexible Substrates and Electronic Devices

The advancement of flexible devices, such as photovoltaics, batteries, or sensors, necessitates the development of specialized adhesive solutions that address critical performance requirements, such as encapsulation or electrical conductivity. Encapsulation adhesives provide robust protection against environmental factors, including moisture, oxygen, and mechanical stress, ensuring the longevity and reliability of sensitive components. Electrically conductive adhesives offer an alternative to traditional soldering methods, enabling efficient electrical interconnections while maintaining the flexibility and lightweight characteristics of the substrate. In this talk, we will introduce key adhesive technologies that are essential for enhancing the performance and durability of flexible devices.