Integration Techniques for Electronic Textiles: Bridging Hard and Soft Materials
The Future of Electronics RESHAPED 2024 USA
11 June 2024
Boston, USA
UMass Boston
Explore practical integration strategies for seamlessly incorporating the Loomia Electronic Layer - a type of E-textile- into various fabrics, trims, and plastics. Delve into the nuanced considerations of each method, with a focus on understanding their advantages, limitations, and ideal applications. This session aims to equip attendees with the knowledge needed to effectively scale electronic integration within trims, providing valuable insights for product developers working at the intersection of rigid and flexible materials. From automotive PU leathers to performance fabrics for AR/VR, this discussion offers practical guidance for navigating the challenges of integrating electronics into textiles and sheet materials.






