Scalable, High-Resolution Microchip-Integrated Liquid Metal Circuits: Enabling the Next Generation of 3R Electronics (Resilient, Repairable, Recyclable)

Over the past decade, gallium-based liquid metals have evolved from scientific curiosity to a leading candidate for next-generation soft and sustainable electronics. Within the next five years, we can expect commercial products made from liquid metal composites to reach the market—but only if we solve key challenges: How can we deposit and pattern liquid metal with high precision? How do we integrate microchips and establish robust connections to flexible circuits? And how can we match or surpass the resolution and multilayer capabilities of today’s printed circuit boards (PCBs)?

In this talk, I will present our integrated approach to these challenges, built on the three pillars of materials innovation, scalable fabrication processes, and circular economy principles. I will introduce the concept of 3R electronics—Resilient, Repairable, and Recyclable—made possible by novel liquid metal composites. Practical techniques such as additive manufacturing, screen printing, and laser patterning will be discussed, along with solutions for microchip interfacing and multilayer circuit construction. If time allows, I will also highlight emerging applications beyond circuitry, including 3R batteries and 3R optoelectronic devices, featuring a breakthrough stretchable transparent conductor and electroluminescent device fabricated entirely from liquid metal composites.