3D Printed Electronics for spaceflight missions
The Future of Electronics RESHAPED 2025 USA
11 June 2025
Boston, USA
UMass Boston
3D Printing of Electronics is being used at NASA Goddard Space Flight Center to develop custom solutions not achievable with traditional manufacturing methods. Unique designs can be achieved that meet mission requirements to achieve science previously not achievable, such as designing communications and instrumentation antennas to be printed on instrument and system surfaces. The trades often made between material dielectric constant, material thickness, mechanical compatibility, and noise minimization can all be mutually accommodated by leveraging printed antenna designs. Custom designs for astrophysics measurements will also be discussed, extending the constellation of achievable measurement for x-ray detection and polarimetry.
Printing strain gauges, localized heaters, and temperature and humidity sensors can help monitor instrument and electronics health as well as take relevant measurements. The capability to print localized sensors and heaters exactly where they are needed to make critical measurements or provide temperature control is a far-reaching advancement in technological development that can increase reliability of spacecraft missions, all while saving size, weight and power (SWaP).
The 3DPE lab also prototypes Printed Circuit Boards, enabling nonrecurring engineering cycles to occur up front as designers complete their preliminary designs. Iterating circuit board designs early and often can quickly eliminate design flaws, enabling a more agile project posture on the path to final flight boards. This creates a more efficient board design cycle, with gains in both cost and schedule.






