Indium Bump Deposition System

Producing indium bumps for interconnect is a technology that has had to adapt to an ever increasing demand for smaller bump size and high bump density while having to process larger and larger substrate sizes. This presentation discusses how indium bump fill and uniformity was optimized for substrates up to 200mm wafers. We demonstrate strategies to both prevent dendritic growth, to produce reliable bumps, and to eliminate indium spits, which can be a source of defects, without having to sacrifice tack time and reliability.