Classifying Additive Electronic Manufacturing Technology: From 2D to 3D and From Simple to Complex System

Additive manufacturing processes have today reached the middle of industry. In some industrial
sectors, the “Hype Cycle” [1] is moving into productivity. The first companies have set up "Digital
Warehouses". The digital printing principle makes it possible to realize "System in Package" (SiP) with higher variety, compared to previous technologies. Currently known manufacturing processes for Additive Manufacturing (AM) are described within standards bodies. Additional materials and methods were developed permanently. There are many possible combinations of materials and procedures, which may seem confusing from outside. From an electronics design & manufacturing perspective, there are unanswered questions and a huge variety of complex procedures. Classifying from the perspective of the Application, the user can identify useful tools, methods and materials which are needed for simple or verry complex AME projects. A side effect can be to optimize processes or to identify gaps in the workflow and closing them and to get a first impression of the possible costs or e.g. the CO2 footprint/sustainability effects. The goal of a classification is supporting user, designer, hard- and software vendor taking advantage of the technology and get in discussion! In previous discussions, the “FED Arbeitskreis 3D Elektronik” has coordinated the classification with institutes and industry partners.