Room temperature electronics bonding in FHE applications, addressing sustainability and cost.

CondAlign’s range of adhesive ACFs for low-temperature, low-pressure bonding of electronics components is well suited for the Flexible and Hybrid Electronics (FHE) area. These products offer electrical and mechanical bonding of components to flexible (and rigid) substrates at room temperature with no heat or other post curing required. With a typical bonding pressure of ca 0,1 – 0,3 MPa, instant functionality is immediately achieved.These adhesive ACFs contain a pressure sensitive adhesive material comprising conductive particles. The particles are aligned in z-direction with the patented technology, creating an anisotropic conductive film. The process is well suited for continuous roll-to-roll production and is implemented in CondAlign’s coating line. The alignment allows for significantly reduced use of particles (while still maintaining good electrical conductivity in Z-direction), which again leads to a) reduced material cost compared to traditional ECAs, b) retaining the initial polymer properties very well (adhesiveness, softness, flexibility, transparency etc),and c) reduced environmental impact through reduced particle content, as well as reduced energy consumption in the bonding process. The reduced environmental impact is documented by an independent part (CEMAsys), which shows a considerable reduction in CO2 emission, compared to two traditional processes: Reflow soldering, and bonding with silver filled epoxy. Extensive in-house and customer tests have been performed, regarding temperature cycling and humidity stability, in-plane and through-plane resistance, mechanical stress, capacity to lead current, adhesiveness etc.