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Robert

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Ceramic-Based Printed Electronics Enabled by Multi-Material Additive Manufacturing

The Future of Electronics RESHAPED 2025

21 October 2025

Berlin, Germany

Estrel

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Recent developments in multi-material additive manufacturing enable the direct integration of conductor and resistor structures within ceramic-based components. By combining materials different functional properties - such as glass ceramics with conductive metals (including silver and copper), conductive ceramic-ceramic pairings, and ceramic-metal combinations, components with integrated electrical functions and a high degree of miniaturization can be realized directly as a component, rather than as separate parts that need to be assembled.

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How does the lengthening of the pathway and reduction of the cross-section of the integrated conductor at the tip specifically contribute to localized heating?

00:03:13 - 00:03:51

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How does the choice of support material impact the overall performance and post-processing requirements of multi-material 3D-printed electronic components?

00:07:41 - 00:07:50

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What are the limitations of using thermoplastic binders in powder-based 3D printing processes, particularly concerning material properties and post-processing requirements?

00:05:11 - 00:05:33

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