Investigation of Electrically Conductive Adhesives for Miniaturized SMD Components
Additive, Printed, Hybrid and Sustainable Electronics Innovations Day 2025
10 December 2025
Online
TechBlick Platform
Reliability of adhesives for MiniLED/MicroLED interconnects
This study investigates the long-term reliability of directional conductive adhesives (DCA) for electrical and mechanical interconnects in MiniLED and MicroLED applications. Building on a previous feasibility study from 2024, the adhesive bonds are subjected to extensive temperature and moisture resistance testing.
Key points:
- Evaluation of three adhesives for semiconductor mass production
- Performance of "light-on" tests, measurement of die-shear strength and U-I characteristics
- Tests under different conditions: Initial, after 500 h at 85°C/85% RH and after 500 h at 120°C
- Analysis of electrical and mechanical properties before and after storage
The results show excellent stability of the adhesive bonds, especially at 120°C storage.
This study represents an important step towards the commercialization of MiniLED and MicroLED applications and positions adhesive technology as a key element for future scalability and cost efficiency in production
