Micro-Transfer Printing: Integrate ultra-thin ASICs to enable sophisticated Applications

Ultra-thin chiplets including individually designed CMOS circuits can be integrated on flexible foils and elsewhere to enable outperforming applications. It is shown that wafers from a powerful BCD-on-SOI platform can be utilized for Micro-Transfer Printing. Micro-Transfer Printing is an emerging technology that de-attaches, transfers and integrates chiplets with very high precision and throughput at the same time. The fabrication flow for CMOS post processing is discussed that enables free standing chiplets having a tether and anker structures still holding chiplets in place.