High Pressure Forming (HPF) for In-Mold Electronics (IME) Processes

Precise 3D forming of substrates is the key to success when it comes to In-Mold Electronics. Not only the 3D forming need to be carried out precisely to fit perfectly into the injection tool cavity, but the positioning of the conductor tracks, the electronic components already positioned in 2D or even graphics must also be in the right position with repeat accuracy. The high-pressure forming process, which uses high-pressure air of up to 90 bar and significantly lower forming temperatures than traditional thermoforming, delivers all of these benefits. Clever automation modules can be used to automate the process for series production and link it to subsequent processes, such as trimming the film inserts after forming.