ACT-3D_Assembly and Connection Technology for 3D plastic carriers

Smartization of existing or new products is a trend that is linked to Industry 4.0 and Internet-of-Things. There are several ways to integrate electronics into or onto 3D products. The combination of printed electronics for circuit layers and the assembly of rigid electronic components onto those circuit layers is one of the solutions that is getting a lot of attention nowadays. However, hybrid electronics (as the combination of both printed and rigid electronics) or structural electronics (as products aim to be 3D), needs adapted materials and processes to achieve functional conductive traces and interconnects. In this presentation we present the process of screen printing of conductive Ag-based inks on different 2D foils and the subsequent thermoforming of the same to achieve 3D circuit layers on which, afterwards, rigid electronics can be placed via the use of pick-and-place and conductive adhesives. Besides the description of the process, the different foils and different inks are discussed in this work and the properties of their combination for functional 3D products is discussed.