The Next-Generation Technology Platform of MicroLED Micro-Display Chip

The current mainstream technology route for MicroLED micro-display chips is wafer-to-wafer metal bonding process. We called it the 2nd-gen tech platform. But we are now hitting its limits.

What are we really aiming for MicroLED micro-display? Higher luminous efficiency, smaller pixel sizes, smaller chip sizes, lower power consumption, etc. This is what our next-generation platform is designed to unlock.

We’ve developed our monolithic full-color MicroLED micro display on our third-generation technology platform, which we call Hybrid Stack Structure (HSS). HSS combines two wafer bonding processes with a quantum dot color conversion layer. It integrates blue and green GaN (gallium nitride) epitaxial wafers and achieves accurate red emission—all while simplifying the manufacturing process and greatly improving optical efficiency.