Alaa Abdellah | Fraunhofer EMFT: What are the key differences and advantages of subtractive versus semi-additive processes for structuring copper in roll-to-roll lithography?
00:05:05 - 00:05:17
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What are the key differences and advantages of subtractive versus semi-additive processes for structuring copper in roll-to-roll lithography?
The presentation outlines two primary methods for structuring or patterning copper in roll-to-roll lithography: a conventional subtractive process and a semi-additive process. The subtractive method involves sputtering the metal, laminating a dry film photoresist, and exposing it using a direct imaging system. This approach offers design flexibility and enables the creation of endless designs.
In contrast, the semi-additive process begins with sputtering a thin seed layer of copper, typically 100-200 nanometers. A resist is then applied, exposed, and developed, followed by electrodepositing copper to the desired thickness only in the areas where it is needed. This allows for the growth of copper up to a few microns thick in specific regions.
The semi-additive process is favored due to its sustainability advantages. After electrodeposition, only the thin seed layer needs to be etched away, reducing material waste and etching time compared to the subtractive process, which requires etching the entire copper layer. This also enables finer patterns when thicknesses are not excessively high.
In this short video, you can learn:
* The steps involved in both subtractive and semi-additive copper patterning.
* The design flexibility offered by the subtractive process with direct imaging.
* The sustainability advantages of the semi-additive process due to reduced material waste.
๐ **Clip Abstract** This segment details two methods for copper patterning in roll-to-roll lithography: subtractive and semi-additive. It highlights the design flexibility of the subtractive method and the sustainability benefits of the semi-additive approach.
๐ Link in comments ๐
#SubtractivePatterning, #SemiAdditivePatterning, #RollToRollLithography, #CopperStructuring, #SemiconductorManufacturing, #FlexibleElectronics
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Endless electronics by R2R processing
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00:00:56 - 00:01:05
How does Fraunhofer EMFT bridge the gap between research and industry, specifically in scaling up processes?
How does Fraunhofer EMFT bridge the gap between research and industry, specifically in scaling up processes?
Fraunhofer EMFT distinguishes itself by offering scale-up and pilot production services, bridging the gap between research and industry. This capability extends beyond mere process development, encompassing the scaling of processes to pre-production or pilot production levels. The ultimate goal is to develop and scale up processes before transferring them to a partner for mass or large-volume production.
The institute's structure, divided into three technology clustersโPrinted Electronics, Lithography and Laser Innovations, and Design and Integrationโenables a comprehensive approach. This multidisciplinary approach allows them to address a wide range of applications, often requiring the collaboration of multiple clusters. This integrated expertise strengthens their offering in the field of flexible systems.
To support these activities, Fraunhofer EMFT operates a pilot line equipped for advanced flexible systems. The equipment is roll-to-roll capable, with both continuous and intermittent operation modes to accommodate varying precision requirements. This infrastructure allows for the development and scaling of processes, ultimately facilitating their transfer to industry partners for mass production.
In this short video, you can learn:
* Fraunhofer EMFT's unique offering of scale-up and pilot production services.
* The institute's three technology clusters and their collaborative approach.
* The role of the pilot line in supporting the development and scaling of flexible systems.
๐ **Clip Abstract** This segment highlights Fraunhofer EMFT's unique position in offering scale-up and pilot production services, bridging the gap between research and industry. It also describes the institute's structure and pilot line capabilities.
๐ Link in comments ๐
#ProcessScaling, #PilotProduction, #RollToRollProcessing, #FlexibleSystems, #SemiconductorProcessing, #PrintedElectronics
00:07:18 - 00:07:35
How does the developed stitching technique overcome limitations in form factor and working area in roll-to-roll lithography?
How does the developed stitching technique overcome limitations in form factor and working area in roll-to-roll lithography?
The presentation addresses the challenge of creating large form factors that exceed the limitations of conventional FPC technology and the working area of stop-and-go roll-to-roll processes. To overcome these limitations, a stitching technique has been developed. This technique involves starting with a specific design and using the first exposure to set alignment marks for subsequent exposures.
The process proceeds iteratively, with each exposure building upon the previous one, guided by the alignment marks. This allows for the creation of designs that extend beyond the working area of a single exposure. The technique incorporates correction mechanisms to compensate for tilt, rotation, and shrinkage of the foil, ensuring accurate alignment across the stitched segments.
Close collaboration with the tool manufacturer has enabled customization of the system and software to support this stitching technique. Each exposure step includes corrections, making it theoretically possible to create endless designs. While electrical requirements may impose limits, the process itself allows for the creation of seamless patterns spanning several meters.
In this short video, you can learn:
* The limitations of conventional FPC technology and stop-and-go processes in creating large form factors.
* The iterative process of the stitching technique, including the use of alignment marks.
* The correction mechanisms used to compensate for foil deformation and ensure accurate alignment.
๐ **Clip Abstract** This segment describes a stitching technique developed to overcome limitations in form factor and working area in roll-to-roll lithography. The technique enables the creation of large, seamless designs by iteratively exposing and aligning segments of the pattern.
๐ Link in comments ๐
#RollToRollStitching, #PatternAlignment, #FoilDeformationCompensation, #LargeAreaPatterning, #FlexibleElectronics, #FPCManufacturing