Amr Maaroufi | Hummink: Why is repair—not high-volume printing—the best business case, and what machine specs support it?
12:47 - 14:46
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Why is repair—not high-volume printing—the best business case, and what machine specs support it?
Two packages share one platform: a standalone tabletop Nazca machine with a 16 by 16 centimetre working area, aimed at technology qualification, R&D and small-scale production, reaching the same resolution as the industrial module. The module is the unit implemented into high-volume manufacturing. The platform is identical; only packaging and substrate-size limits differ. Removing the Nazca's substrate constraint lets the same printing approach enter an industrial environment.
The commercial case is repair, not throughput. High precision is the value: repairing features that would otherwise be lost improves yield points. The printing module is integrated onto repair tools, especially in displays, an industry already familiar with repair. The tool repairs features down to micron size; they have repaired display features around 20 microns, tens of microns when challenged, and are very comfortable at 10 microns and below.
A software layer makes the solution easy to use. Users implement the design they want and iterate quickly in an industrial environment. An API manages communication, which matters for defect-inspection topics. The team has experience working with OEMs and says those conversations are open. The module, not the tabletop unit, is what drops into industrial lines where substrate size no longer limits the process.
In this short video, you can learn:
* The Nazca tabletop machine has a 16 by 16 centimetre working area yet matches the industrial module's resolution.
* Repair at 10 microns and below, with display features around 20 microns repaired, is where the process is most comfortable.
* An API and software layer let users implement designs and iterate quickly, supporting OEM discussions about defect inspection.
📋 **Clip Abstract** Two packages of one printing platform are described: a standalone Nazca tabletop unit for R&D and small-scale production, and an industrial module for high-volume manufacturing. The commercial focus is repair—integrating the module into repair tools to recover yield at micron-scale features, with a software layer and API for design iteration and defect-inspection workflows.
About the speaker:
* Speaker: Amr Maaroufi
* Company: Hummink
* Event: Eindhoven 2026
* Location: High Tech Campus, Eindhoven
#MicroLEDRepair, #PrintingModule, #NazcaPlatform, #MicronRepair, #MicroLED, #DisplayManufacturing
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HPCaP: A New Technology for MicroLED Manufacturing
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04:58 - 06:47
How wide is the viscosity and resolution window compared with inkjet, and what is the smallest printed feature?
How wide is the viscosity and resolution window compared with inkjet, and what is the smallest printed feature?
Developed since 2020 through in-house R&D, the process shows a notably wide process window. The clearest benchmark is viscosity: conventional inkjet printing handles inks up to 50 centipoise, while this contact-based approach has been demonstrated with inks up to 250,000 centipoise. That range lets formulators use far more viscous materials than drop-on-demand jetting tolerates, and the team presents it as central to the versatility of the MicroLED manufacturing approach.
Because the process establishes contact rather than jetting droplets, the speaker describes it as very precise. There is no jetting, so there is no risk of splash drops or scalloping around the edges. That is the second element of the process window, alongside viscosity. Contact, rather than ejection, is the mechanism that the team says enables precision, and it underlies the resolution results presented next.
On resolution, the team reports a smallest printed feature of 500 nanometres, which the speaker describes in terms of both the pipette opening and the size of the dot. At the other end, pipettes with openings up to 50 microns can be used. That combination gives a wide range in resolution, spanning 50-micron pipette openings down to 500-nanometre printed features, and it is presented as another dimension of the process window alongside viscosity.
In this short video, you can learn:
* Inkjet is limited to inks of about 50 centipoise, while this contact process has been demonstrated with inks up to 250,000 centipoise.
* Because it establishes contact instead of jetting, the process avoids splash drops and scalloping around printed edges.
* The smallest printed feature demonstrated is 500 nanometres, with pipette openings available up to 50 microns.
📋 **Clip Abstract** Since 2020, the developer has built a contact-based additive process whose viscosity window reaches 250,000 centipoise, against roughly 50 centipoise for inkjet. It delivers features down to 500 nanometres with pipette openings up to 50 microns, avoiding jetting artefacts such as splash drops and edge scalloping for MicroLED manufacturing.
About the speaker:
* Speaker: Amr Maaroufi
* Company: Hummink
* Event: Eindhoven 2026
* Location: High Tech Campus, Eindhoven
#ContactPrinting, #HighViscosityInks, #SplashFreeDeposition, #SubMicronFeatures, #MicroLEDManufacturing, #AdditiveManufacturing
17:32 - 19:12
How does Hummink answer XCPL and Photonic Tech's impulse printing, and what qualification evidence exists?
How does Hummink answer XCPL and Photonic Tech's impulse printing, and what qualification evidence exists?
The landscape now holds several competing deposition routes. XCPL is described as compatible with the topologies but serial in operation, while impulse printing from Photonic Tech is parallel and addresses the same viscosity range. Hummink's stated position is application-led: the sensible next step is testing the technology against the actual application, rather than adjudicating the rivalry on paper. Compatibility with the existing topology families is not, on its own, the deciding criterion.
On materials, the claim is compatibility in viscosity, in materials and in resolution — the three axes that decide whether a tool can enter a MicroLED line. The stated route to differentiation is technology qualification rather than headline claims. Once a specific case exists and both sides walk through the demo, the company says it can supply data showing the technology is working, moving the conversation past the concept stage.
Concrete evidence is offered from a big display player, where discussions have run through multiple qualification steps. That process made it, in the speaker's words, abundantly clear that the technology can do very good on technical qualification. The asserted advantage is therefore the ability to prove technically that the technology works and to walk a partner through qualification — something demonstrable once a concrete case and the full process are in place.
In this short video, you can learn:
* XCPL is described as compatible with the topologies but serial, while Photonic Tech's impulse printing is parallel and covers the same viscosity range.
* Hummink claims compatibility across viscosity, materials and resolution, but frames qualification, not claims, as the differentiator.
* A big display player has taken the technology through multiple qualification steps, which the speaker cites as proof it performs on technical qualification.
📋 **Clip Abstract** Hummink positions itself against XCPL's serial, topology-compatible approach and Photonic Tech's parallel impulse printing by claiming matching viscosity, material and resolution envelopes. Its stated differentiator is qualification: demos on concrete cases, with multiple steps already completed alongside a big display player.
About the speaker:
* Speaker: Amr Maaroufi
* Company: Hummink
* Event: Eindhoven 2026
* Location: High Tech Campus, Eindhoven
#MicroLEDDeposition, #ImpulsePrinting, #ViscosityCompatibility, #TechnicalQualification, #MicroLEDs, #DisplayManufacturing
09:41 - 11:37
Can one printing process make 3–5 micron bumps, repair lines, print waveguides and 660 nm quantum dots?
Can one printing process make 3–5 micron bumps, repair lines, print waveguides and 660 nm quantum dots?
The bumping capability spans small bumps starting from three to five-micron diameters with various aspect ratios, up to bumps that are fifty microns. The method can also produce bonding, especially for LDL, and conductive lines. One application is conductive line repair in the display industry. Bumping works because there is a special formulation in regards to the inks, and the range covers both fine features and larger bumps.
The process has also been used on waveguides, and dielectric has been used to do it. It does not necessarily need to be just metal ink. The tool can work either with metal ink for conductive properties or with dielectric for other properties, be them encapsulation or, depending on the application, optical properties. That means the process can address conductive, encapsulation, or optical requirements. This material flexibility is one application the method can support.
A very concrete example with a partner involved printing color-converting quantum dots. The smallest print achieved with the technology is multiple matrices of dots, demonstrating high versatility in features. The smallest dots are around 660 nanometers, and the range can go up to tens of microns. This is all with the same machine and same technology. The capability therefore covers nanoscale color converters up to larger printed features.
In this short video, you can learn:
* Bumps can be printed from three to five-micron diameters with various aspect ratios up to fifty microns.
* The process can produce conductive lines, repair display lines, and deposit dielectric on waveguides.
* Color-converting quantum dots have been printed down to around 660 nanometers and up to tens of microns on the same machine.
📋 **Clip Abstract** The process can produce 3–5 micron bumps, 50 micron bumps, conductive lines, dielectric layers and color-converting quantum dots. It has been used for conductive line repair in displays and on waveguides, with metal inks for conductivity and dielectrics for encapsulation or optical properties.
About the speaker:
* Speaker: Amr Maaroufi
* Company: Hummink
* Event: Eindhoven 2026
* Location: High Tech Campus, Eindhoven
#MicroBumping, #ConductiveLineRepair, #DielectricInks, #QuantumDotPrinting, #MicroLEDManufacturing, #PrintedElectronics