Carolyn Ellinger | Eastman Kodak Company: What are the hidden registration and tolerance pitfalls when transitioning from sheet-to-sheet to true roll-to-roll flexographic printing?
16:07 - 17:23
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Summary of the clip:
What are the hidden registration and tolerance pitfalls when transitioning from sheet-to-sheet to true roll-to-roll flexographic printing?
Transitioning printed electronics from sheet-to-sheet prototyping to high-volume roll-to-roll (R2R) production introduces complex mechanical variables, especially regarding layer-to-layer alignment. Unlike sheet-based systems where individual sheets can be dynamically aligned and adjusted relative to the print tooling, true R2R printing keeps the web continuously connected under tension.
In a high-speed flexographic system, the print tooling is a rigid analog cylinder. Consequently, registration tolerances must accommodate web tension, substrate deformation, and cumulative runout, requiring designers to negotiate functional product specifications rather than relying on the idealized, per-sheet adjustments possible in low-volume R&D.
In this short video, you can learn:
* The fundamental registration differences between dynamic sheet-to-sheet alignment and continuous roll-to-roll printing.
* How rigid analog print cylinders and a connected moving web affect layer-to-layer alignment tolerances.
* Strategies for reconciling design tolerances with the physical realities of high-speed web tension and material properties.
π **Clip Abstract** Carolyn Ellinger highlights the core challenges of scaling printed electronics from sheet-to-sheet to continuous roll-to-roll manufacturing. She emphasizes that managing registration and layer-to-layer alignment on a continuous web requires adapting to rigid analog tooling and web tension.
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#RollToRollRegistration, #FlexographicPrinting, #WebTensionControl, #SubstrateDeformation, #PrintedElectronics, #FlexibleElectronics
This is a highlight of the presentation:
Flexography for High-Resolution Roll-to-Roll Manufacturing
Future of Electronics RESHAPED USA 2026
10-11 June 2026
Computer History Museum, Mountain View, California, USA
Organised By:
TechBlick
More Highlights from the same talk.
02:20 - 03:35
How does Kodak print low-void, high-aspect-ratio copper microwires down to 6-8 microns using flexography and electroless deposition?
How does Kodak print low-void, high-aspect-ratio copper microwires down to 6-8 microns using flexography and electroless deposition?
Kodak leverages its legacy in roll-to-roll additive manufacturing to print functional electronics using flexography in a cleanroom environment. At a design resolution of 12,800 DPI (approx. 2 microns per pixel), the process routinely achieves 6 to 8-micron physical features on web substrates.
The core of Kodak's microwire technology lies in printing a catalyst followed by electroless copper deposition rather than electrochemical plating. This enables the formation of isolated conductive islands and complex rectilinear meshes without requiring continuous electrical connections across the entire design layout during processing.
In this short video, you can learn:
* How flexographic printing of catalysts coupled with electroless copper deposition creates independent, isolated conductive islands.
* The trade-offs between a design-level 2-micron pixel resolution and real-world 6 to 8-micron features on substrate.
* Why electroless deposition provides greater design freedom compared to traditional electrochemical plating methods.
π **Clip Abstract** This clip details Eastman Kodak's high-resolution flexographic printing and electroless plating process for creating copper microwires. Carolyn Ellinger explains how printing catalysts enables independent conductive features down to 6-8 microns without requiring electrical connections for electroplating.
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#ElectrolessDeposition, #FlexographicPrinting, #CopperMicrowires, #CatalystPrinting, #PrintedElectronics, #RollToRollManufacturing
00:00:24 - 00:00:29
How does the interplay between design resolution and printing resolution impact the final feature size on the substrate?
How does the interplay between design resolution and printing resolution impact the final feature size on the substrate?
Kodak's flexographic printing capabilities enable high-resolution patterning, starting with a design resolution of 12,800 DPI, which translates to two-micron pixels in the design phase. However, the resolution achievable on the substrate after printing varies, typically ranging from six to thirty microns. This discrepancy is primarily influenced by the characteristics of the inks used in the printing process.
The speaker emphasizes that the final feature size on the substrate is not solely determined by the initial design resolution. Ink properties, such as viscosity, surface tension, and wetting behavior, play a crucial role in how the ink spreads and adheres to the substrate during printing. Different inks will exhibit varying degrees of spreading, leading to the observed range of six to thirty microns.
Therefore, achieving the desired feature size requires careful consideration of both the design resolution and the ink properties. Optimizing the ink formulation and printing parameters is essential to minimize spreading and maintain the fidelity of the printed features. This highlights the importance of a holistic approach that considers the entire printing process, from design to material selection, to achieve the desired outcome.
In this short video, you can learn:
* The design resolution capabilities of Kodak's flexographic printing.
* The range of feature sizes achievable on the substrate.
* The influence of ink properties on the final printed resolution.
π **Clip Abstract** This segment discusses the resolution capabilities of Kodak's flexographic printing, highlighting the difference between design resolution (12,800 DPI) and achievable feature sizes on the substrate (6-30 microns), emphasizing the role of ink properties.
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#FlexographicPrinting, #DesignResolution, #PrintingResolution, #InkProperties, #PrintedElectronics, #AdvancedDisplays
07:01 - 08:05
Why is 3D aspect ratio management critical when moving from silver inks to printed copper microwires?
Why is 3D aspect ratio management critical when moving from silver inks to printed copper microwires?
While X and Y dimensions define the resolution and footprint of a circuit, the Z-dimension (ink thickness) dictates electrical and optical performance. Flexography bridges the gap between thin inkjet printing and thick-film screen printing, but controlling ink spread during drying and curing remains a major challenge.
To bypass the lateral spreading associated with thick silver inks, Kodak utilizes a hybrid approach: printing an ultra-thin catalyst layer to minimize initial line-width expansion, then building up vertical thickness via electroless copper plating. This maintains high aspect ratios with low feature resistance while keeping the overall trace width extremely narrow.
In this short video, you can learn:
* Why controlling the Z-axis (aspect ratio) is just as critical as X-Y resolution in printed electronics.
* How thin catalyst printing followed by electroless copper buildup prevents ink spreading.
* The positioning of flexography relative to screen printing and inkjet technologies in terms of deposited thickness.
π **Clip Abstract** Carolyn Ellinger explains the crucial role of aspect ratio and the Z-dimension in high-resolution printed electronics. She highlights how printing a thin catalyst layer followed by electroless copper plating prevents the ink-spreading issues common to thick silver printing.
π Link in comments π
#ElectrolessCopperPlating, #CopperMicrowires, #FlexographicPrinting, #HighAspectRatioTraces, #PrintedElectronics, #AdditiveMetallization