Dr. Manish Ojha | NoiseFigure Research: How do you perform chip-level assembly and solder bumping on highly delicate, flexible substrate materials?
00:11:56.260 - 00:13:08.292
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Summary of the clip:
How do you perform chip-level assembly and solder bumping on highly delicate, flexible substrate materials?
In this clip, Dr. Ojha demonstrates the successful integration of active silicon chipsets onto flexible packages using NFR’s custom fine-pitch solder bumping process. This technique overcomes standard wafer-scale limitations by offering a robust die-by-die transfer method ideal for low-volume prototypes.
The assembly relies on screen-printing a solder mask onto an FR4 panel, laser-patterning cavities, and filling them with solder paste. Flipping and reflowing the die transfers the solder to the die pads, enabling a secondary reflow onto flexible substrates like polyimide, Willow Glass, or alumina ribbon ceramics.
The final demonstration showcasing the hand-flexing of a fully assembled 40 GHz rectenna validates the mechanical robustness of the design. This proves that additively manufactured flexible packages can survive fabrication, chip reflow, and continuous mechanical stress.
In this short video, you can learn:
* The step-by-step process of transferring solder bumps to dies for flexible hybrid electronics.
* How to handle chip-level integration for prototype-scale flexible packages without wafer-level tools.
* Mechanical compliance testing of a 40 GHz rectenna during hand-bending validation.
📋 **Clip Abstract** Dr. Ojha demonstrates the assembly of a 40 GHz rectenna within a flexible FlySIP package using custom solder bumping. He showcases the structural integrity of the fully integrated device under mechanical flexing.
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#SolderBumping, #FlySIP, #FlexibleRectenna, #WillowGlass, #FlexibleHybridElectronics, #AdvancedPackaging
This is a highlight of the presentation:
High-Resolution Printed Copper Antennas for Flexible mm Wave Electronics
Future of Electronics RESHAPED USA 2026
10-11 June 2026
Computer History Museum, Mountain View, California, USA
Organised By:
TechBlick
More Highlights from the same talk.
00:01:20.160 - 00:02:26.480
Can we bridge the gap between high-resolution sub-10 micron printing and industrial-scale manufacturing throughput for flexible packages?
Can we bridge the gap between high-resolution sub-10 micron printing and industrial-scale manufacturing throughput for flexible packages?
In this segment, Dr. Manish Ojha addresses the core bottleneck of low-to-mid volume manufacturing for flexible multi-layer semiconductor packaging. Standard high-resolution printing processes, such as electrohydrodynamic (EHD) inkjet printing, can print sub-10 micron features but suffer from painfully low throughput, requiring hours to print a single small package.
The presentation introduces the FlySIP (Flexible System in Package) roadmap, designed to preserve ultra-fine resolution while scaling throughput to industrial levels. By moving away from single-printer dependencies, this hybrid approach aims to optimize manufacturing speed for conformable antennas and wearable RF sensors.
This setup serves as a foundational paradigm shift for additive packaging. It lays the groundwork for combining high-throughput coarse printing with high-resolution fine-trace printing in a single seamless flow.
In this short video, you can learn:
* The key bottlenecks of low-to-mid volume additive manufacturing in flexible packaging.
* Why single-nozzle EHD printing takes hours for small-scale layouts and how FlySIP addresses this.
* The target applications for high-resolution flexible packages including wearable RF sensors and compact millimeter-wave systems.
📋 **Clip Abstract** Dr. Manish Ojha introduces the concept of FlySIP and the throughput challenges of fabricating flexible multi-layer packages. He explains how combining high-resolution EHD printing with faster methods solves the low-volume manufacturing bottleneck.
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#EHDPrinting, #FlexibleSystemInPackage, #AdditivePackaging, #Sub10Micron, #PrintedElectronics, #WearableRFSensors
00:05:41.480 - 00:08:37.360
How can engineers mix micro-scale screen printing and electrohydrodynamic inkjetting in a single multi-layer hybrid process?
How can engineers mix micro-scale screen printing and electrohydrodynamic inkjetting in a single multi-layer hybrid process?
This clip details the step-by-step hybrid additive process used in FlySIP. Dr. Ojha explains how the manufacturing flow assigns different printing methodologies to specific features based on dimensions, using screen printing for coarse features and EHD inkjetting for sub-10 micron lines.
The process incorporates ultra-fast laser drilling capable of producing 100 vias per second with entrance diameters of 25 microns and exit diameters down to 5 microns. These vias are then filled using stencil printing, allowing copper paste to be integrated at high speeds before proceeding to conductor deposition.
Furthermore, the dielectric layer is deposited via sheet-to-sheet screen printing, resulting in via openings under 50 microns and a tightly controlled 30-micron layer thickness. This level of precise height control is vital for mitigating capacitive coupling and matching impedance in high-frequency RF lines.
In this short video, you can learn:
* How to select the optimal printing tool for vias, coarse conductors, and fine traces.
* The metrics and throughput of laser-drilled micro-vias on flexible substrates.
* The critical role of controlled screen-printed dielectric layers in multi-layer RF routing.
📋 **Clip Abstract** This video outlines the hybrid manufacturing steps of FlySIP, utilizing laser drilling, stencil filling, and screen printing. Dr. Ojha illustrates how combining EHD and screen printing satisfies both throughput and sub-10 micron resolution demands.
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#ElectrohydrodynamicInkjet, #MicroScreenPrinting, #LaserMicroVias, #StencilViaFilling, #SystemInPackage, #FlexibleRF