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Dr. Michael Grouchko

Copprint

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Dr. Michael Grouchko | Copprint: How does additive printing achieve a 35x reduction in copper consumption compared to subtractive etching?

00:11:45 - 00:14:02

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Summary of the clip:

How does additive printing achieve a 35x reduction in copper consumption compared to subtractive etching?

Transitioning from subtractive chemical etching to the additive screen printing of copper inks yields a massive reduction in carbon footprint of at least 50%. The key to this reduction lies in the fundamental physics of material utilization. Subtractive etching laminates a solid sheet of copper across the entire substrate and etches away the unneeded areas, wasting valuable raw material.

In a real-world remote control circuit board, traditional subtractive manufacturing starts with a solid 25-micron copper layer, leaving 35% copper coverage after etching and utilizing 5.2 grams of copper in the final device. Additive printing, by contrast, only deposits the conductive copper paste precisely where the circuit traces are required.

This selective deposition covers only about 7.5% of the substrate area. Furthermore, additive printing can deposit much thinner functional layers, reducing the trace thickness to 12 microns or even below 6 microns. This brings the final copper mass down to a mere 0.14 grams per remote control, representing a staggering 35-fold reduction in raw copper consumption.

In this short video, you can learn:
* The quantitative carbon footprint reduction achieved by switching to additive printing.
* A direct material consumption comparison between subtractive etching and additive screen printing.
* How additive copper printing achieves functional trace thicknesses down to 6 microns.

πŸ“‹ **Clip Abstract** This clip breaks down the dramatic material efficiency of additive copper printing compared to subtractive etching, demonstrating a 35x reduction in copper consumption. Dr. Grouchko presents a case study of a remote control board to illustrate how printing minimizes both coverage area and trace thickness.

#AdditiveCopperPrinting, #CopperConductiveInk, #ScreenPrintedElectronics, #SubtractiveEtching, #PrintedElectronics, #SustainableElectronics

This is a highlight of the presentation:

Additive, Sustainable or 3D Electronics Innovations Day 2025

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04.04.2025

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00:02:51 - 00:04:52

Why do we still call them "Printed" Circuit Boards when they are actually chemically etched?

Why do we still call them "Printed" Circuit Boards when they are actually chemically etched?

The term PCB (Printed Circuit Board) is a misnomer in modern electronics manufacturing. While the very first circuit boards a century ago utilized printed conductive silver paste, the industry pivoted to subtractive chemical etching nearly 75 years ago to scale production. Today, this legacy subtractive process has become a massive environmental and regulatory liability.

Traditional chemical etching is highly toxic, resource-intensive, and carbon-heavy. In fact, the PCB manufacturing industry is currently responsible for an estimated 0.5% of total global carbon dioxide equivalent emissions. Because of these severe pollution issues, wet-chemical etching is increasingly restricted by environmental regulations, concentrating production in specific geographic regions.

While silver inks exist as an additive alternative, their high material costs and substantial carbon footprints make them commercially unviable for mass-market replacement. Utilizing advanced copper inks allows manufacturers to return to true additive printing, offering a cost-effective, decentralized, and environmentally sustainable alternative to toxic acid etching.

In this short video, you can learn:
* The historical evolution of PCB manufacturing from additive printing to subtractive etching.
* Why the modern subtractive etching industry accounts for 0.5% of global CO2 equivalent emissions.
* The economic and environmental limitations of using silver-based conductive inks as an alternative.

πŸ“‹ **Clip Abstract** This clip exposes the environmental and regulatory crises facing the subtractive PCB etching industry, which contributes 0.5% of global CO2 emissions. Dr. Grouchko argues that migrating back to true additive printing using copper inks is the only path to clean, cost-competitive electronics manufacturing.

#SubtractiveEtching, #CopperConductiveInks, #AdditivePCB, #ConductiveInks, #PrintedElectronics, #FlexibleElectronics

00:16:24 - 00:18:51

Can printed copper inks overcome the dual challenges of high electrical resistivity and atmospheric oxidation?

Can printed copper inks overcome the dual challenges of high electrical resistivity and atmospheric oxidation?

A primary technical concern when replacing bulk etched copper with printed copper paste is electrical performance and environmental stability. Sintered copper inks achieve a conductivity of approximately 33% of bulk copper, resulting in a resistivity about three times higher than etched copper. While this excludes it from high-power electronics, it is highly suitable for standard devices like remote controls, sensors, and RFIDs.

To guarantee long-term stability under field conditions, the printed copper must withstand aggressive accelerated aging. Under standard 85/85 environmental testing (85 degrees Celsius and 85% relative humidity), a properly sintered printed copper layer stabilizes and reaches a conductivity plateau, proving its long-term reliability over time.

Addressing the inherent thermodynamic tendency of copper to oxidize, the printed electronics industry employs standard industrial protective measures. By applying Organic Solderability Preservatives (OSP) or sealing the conductor within the final device assembly, the printed copper remains highly solderable, prevents oxidation, and maintains excellent intermetallic bonding.

In this short video, you can learn:
* The electrical conductivity and resistivity metrics of printed copper relative to bulk copper.
* How sintered copper behaves under accelerated environmental aging tests (85/85 testing).
* Industrial techniques like OSP coatings used to protect printed copper traces from oxidation.

πŸ“‹ **Clip Abstract** This clip addresses critical technical questions regarding the conductivity, thermal stability, and oxidation mitigation of printed copper inks. Dr. Grouchko explains how sintering quality ensures long-term environmental reliability and outlines the industry methods used to protect printed traces from degrading.

#SinteredCopperInks, #OrganicSolderabilityPreservatives, #8585Testing, #AdditiveMetallization, #PrintedElectronics, #AdditiveElectronics

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