Edward Tierney | Copprium: How close can nano-copper inks get to the bulk conductivity of pure copper?
00:09:50 - 00:11:35
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Summary of the clip:
How close can nano-copper inks get to the bulk conductivity of pure copper?
Achieving high electrical conductivity in printed copper traces requires maximizing the bulk conductivity percentage after low-temperature sintering. Formulations that reach up to 80 percent of pure bulk copper's conductivity offer a highly viable alternative to silver for high-performance applications.
Managing particle size distribution is critical for fluid stability and print resolution. Keeping particle sizes below 10 microns—and even scaling down to sub-micron and molecular regimes—enables compatible jetting through fine-nozzle printheads without clogging.
To prevent oxidation during the low-temperature sintering process (sub-150 degrees C), researchers employ advanced ligand capping technologies. These organic protective shells stabilize the copper nanoparticles in suspension and cleanly decompose during sintering to allow metal-to-metal coalescence.
In this short video, you can learn:
- Conductivity performance reaching up to 80 percent of bulk copper.
- Particle size control below 10 microns to prevent nozzle clogging during deposition.
- The use of ligand capping chemistry to prevent oxidation and facilitate low-temperature sintering.
📋 Clip Abstract: This Q&A session details the technical specifications of advanced copper inks, focusing on conductivity metrics and particle size control. The speaker explains how ligand capping chemistry resolves the oxidation problem while maintaining sintering temperatures below 150 degrees C.
#NanoCopperInk, #LowTemperatureSintering, #LigandCapping, #ConductiveInks, #PrintedElectronics, #AdditiveElectronics
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00:03:44 - 00:05:06
Why has copper failed to replace silver in printed electronics until now?
Why has copper failed to replace silver in printed electronics until now?
Macro-scale copper presents severe processing challenges, notably rapid oxidation and corrosion during sintering, which degrades electrical conductivity. This has historically forced the printed electronics industry to rely on expensive silver, despite cost and supply-chain pressures.
Sintering temperature represents another critical roadblock. Standard copper inks require high temperatures to sinter, making them incompatible with inexpensive, low-temperature plastic and flexible substrates commonly used in cost-sensitive applications.
Transitioning to nanotechnology offers a pathway to bypass these limitations. By controlling particle sizes and implementing advanced chemical stabilization, it is possible to drastically lower sintering temperatures and prevent oxidation, paving the way for high-throughput, low-cost flexible electronics.
In this short video, you can learn:
- The critical technical barriers of macro-scale copper inks, including rapid oxidation and corrosion.
- How sintering temperature constraints limit substrate compatibility for low-cost printed electronics.
- The role of nanotechnology in lowering thermal budgets and enabling fine-line printing.
📋 Clip Abstract: This clip outlines the historical technical hurdles of using macro-scale copper in conductive inks, focusing on oxidation and high sintering temperatures. It explains how shifting to nanotechnology can overcome these challenges to enable cheaper, flexible electronic substrates.
#CopperConductiveInks, #CopperNanoparticles, #LowTemperatureSintering, #FlexibleSubstrates, #PrintedElectronics, #AdditiveElectronics
00:05:55 - 00:07:16
Can nano-copper inks achieve silver-like conductivity at temperatures below 150 degrees C?
Can nano-copper inks achieve silver-like conductivity at temperatures below 150 degrees C?
Managing the thermal budget is a primary challenge in printed electronics, particularly when printing on heat-sensitive polymeric substrates. Developing a nano-copper ink capable of sintering below 150 degrees C allows manufacturers to replace silver without damaging common flexible films.
This nanotech-enabled approach directly addresses the oxidation problem through specialized molecular capping, protecting the highly reactive copper nanoparticles from ambient oxygen during the deposition and curing phases. This ensures stable, long-term electrical performance.
By offering micron, sub-micron, and zero-particle molecular ink formulations, material scientists can achieve high-resolution, fine-trace printing. This flexibility supports various deposition methods, including inkjet and aerosol jetting, while slashing material costs by up to 40 percent.
In this short video, you can learn:
- Low-temperature sintering capabilities under 150 degrees C for delicate substrates.
- Strategies for overcoming copper oxidation and corrosion via nano-formulation.
- The introduction of zero-particle molecular inks for high-resolution, fine-trace printed electronics.
📋 Clip Abstract: This clip introduces Copprium's advanced nano-copper and molecular ink solutions designed to directly replace silver in printed electronics. It highlights key performance metrics, including sub-150 degrees C sintering temperatures, oxidation mitigation, and a 40 percent reduction in raw material costs.
#NanoCopperInks, #LowTemperatureSintering, #ParticleFreeInks, #OxidationMitigation, #PrintedElectronics, #FlexibleElectronics