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Eric MacDonald

University of Texas at El Paso

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Eric MacDonald | University of Texas at El Paso: Why do conductive inks on ceramic substrates outperform those on polymers by an order of magnitude?

14:16 - 15:44

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Summary of the clip:

Why do conductive inks on ceramic substrates outperform those on polymers by an order of magnitude?

A fundamental limitation of printed electronics on common polymer substrates is the low curing temperature they can withstand, typically around 200-250ยฐC. This temperature is insufficient to fully sinter or melt the metallic nanoparticles in conductive inks. As a result, the final traces consist of loosely connected particles, leading to conductivity that is significantly lower than that of bulk metal.

Ceramic substrates, however, are thermally robust and can endure processing temperatures up to 1000ยฐC or higher. When a conductive ink is deposited into a trench on a ceramic part and fired at these elevated temperatures, a dramatic change occurs in the material's microstructure. The metal particles coalesce and melt, forming a continuous, dense metallic structure within the trench.

As shown in SEM images comparing different firing temperatures, the progression from a particulate structure to a nearly solid, bulk-like metal is clear. This ability to fully melt the metal allows the printed traces to approach the bulk conductivity of the parent material. This leap in performance opens the door for high-power and high-frequency applications that are impossible with polymer-based printed electronics.

In this short video, you can learn:
* The key limitation of low-temperature curing for conductive inks on polymers.
* How high-temperature firing on ceramic substrates transforms ink microstructure.
* Why this process enables printed traces to approach true bulk metal conductivity.
๐Ÿ“‹ **Clip Abstract** This clip explains the critical materials science advantage of using ceramic substrates for printed electronics. By enabling high-temperature firing up to 1000ยฐC, the metallic particles in conductive inks can be fully melted, achieving near-bulk conductivity that is unattainable on temperature-sensitive polymer substrates.
๐Ÿ”— Link in comments ๐Ÿ‘‡

#ConductiveInks, #CeramicSubstrates, #HighTemperatureSintering, #BulkConductivity, #PrintedElectronics, #HighFrequencyElectronics

This is a highlight of the presentation:

The Future of Electronics RESHAPED 2024

23-24 OCT 2024

Estrel Congress Centre, Berlin, Germany

Organised By:

TechBlick

More Highlights from the same talk.

09:30 - 10:53

How can you embed and protect sensitive electronics inside a monolithic, high-performance ceramic structure?

How can you embed and protect sensitive electronics inside a monolithic, high-performance ceramic structure?

This clip presents a novel manufacturing concept for creating robust, multifunctional electronic devices by leveraging the unique properties of 3D printed ceramics. The process begins by printing two separate, mating halves of a ceramic substrate, such as alumina. These "green" parts are then sintered in a furnace at 1600ยฐC for several days, a critical step that densifies the material but also causes a significant and challenging 18% shrinkage that must be precisely managed for the final parts to fit together.

The key innovation is a "cascaded thermal post-processing" workflow that enables the integration of different materials. After the high-temperature sintering of the ceramic, conductive inks are deposited into pre-designed trenches and fired at 850ยฐC. Because the ceramic substrate can easily withstand this temperature, the metallic particles in the ink can be properly sintered, achieving near-bulk conductivity that is impossible on temperature-sensitive polymer substrates.

Finally, standard electronic components are placed and attached using a low-temperature cure of around 100ยฐC for adhesion. The two fully populated ceramic halves are then mated and sealed. This creates a final device where the electronics and high-performance interconnects are fully embedded and protected within the interior of the hermetic ceramic structure, offering superior durability and thermal management compared to surface-mounted designs.

In this short video, you can learn:
* A multi-step process for creating 3D multifunctional ceramic electronics.
* The concept of "cascaded thermal post-processing" to combine high-temperature inks and low-temperature components.
* How to overcome the limitations of surface-only electronics by embedding components within a mated ceramic structure.
๐Ÿ“‹ **Clip Abstract** This clip outlines a novel manufacturing workflow for creating robust 3D electronic devices using additively manufactured ceramic substrates. The process leverages a sequence of descending temperature steps to integrate high-conductivity sintered inks and standard electronic components within a fully enclosed, protective ceramic body.
๐Ÿ”— Link in comments ๐Ÿ‘‡

#3DPrintedCeramics, #EmbeddedElectronics, #CascadedThermalProcessing, #HighTemperatureInks, #AdditiveElectronics, #3DElectronics

00:14:31 - 00:15:40

Can you 3D print a material that bends radio waves like a glass lens bends light?

Can you 3D print a material that bends radio waves like a glass lens bends light?

This clip introduces the concept of a Luneburg lens, an advanced RF device that can focus electromagnetic waves. The principle relies on creating a material with a spatially varying refractive index. Using additive manufacturing, this is achieved by printing a ceramic sphere with a precisely controlled, graded densityโ€”100% dense at the core and progressively less dense towards the outer surface.

The density of the ceramic lattice directly correlates with its effective dielectric constant, or permittivity. By gradually decreasing the density from the center outwards, the permittivity is also lowered. This gradient in permittivity effectively changes the speed of electromagnetic waves as they travel through different parts of the lens, causing them to bend and converge at a focal point, much like an optical lens.

This ability to "sculpt" electromagnetic waves by controlling the 3D density of a dielectric material is a powerful application of ceramic additive manufacturing. It enables the creation of complex, high-frequency components like lenses and antennas with performance characteristics that are impossible to achieve with traditional manufacturing. This opens up new possibilities for telecommunications, radar, and sensing systems.

In this short video, you can learn:
* The operating principle of a Luneburg lens for focusing electromagnetic waves.
* How 3D printing a graded-density lattice creates a functionally graded permittivity.
* The potential of this technology for creating advanced, high-performance RF components.
๐Ÿ“‹ **Clip Abstract** Discover how additive manufacturing of ceramics can create functionally graded materials to control and focus electromagnetic waves. This clip explains how printing a Luneburg lens with a radially decreasing density creates a variable permittivity, enabling advanced RF applications like high-gain antennas.
๐Ÿ”— Link in comments ๐Ÿ‘‡

#LuneburgLens, #CeramicAdditiveManufacturing, #FunctionallyGradedMaterials, #RFWaveManipulation, #Telecommunications, #RadarSystems

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