Eyal Cohen | DR Utilight Corp: What are the key specifications of the high-speed scanner used in the laser transfer equipment?
00:04:20 - 00:04:26
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Summary of the clip:
What are the key specifications of the high-speed scanner used in the laser transfer equipment?
The laser transfer equipment incorporates a newly developed scanner designed for high-volume manufacturing. This scanner is capable of operating at a scanning frequency of 350 Hz. This high scanning speed is crucial for achieving the throughput required in the photovoltaic industry.
The speaker highlights the scanner's ability to print 150 fingers, a typical number for a photovoltaic cell of 182 millimeters in size, in less than one second. This speed is essential to meet the demands of the photovoltaic industry, where high-speed production is paramount. The line-by-line printing approach also allows for dynamic adjustments to the pitch of the printed pattern on the final substrate.
The ability to dynamically change the pitch during the printing process offers flexibility in pattern design and optimization. This is particularly useful in applications where precise control over the spacing between printed features is required. The combination of high scanning speed and dynamic pitch control makes the scanner a key component of the laser transfer equipment.
In this short video, you can learn:
* The scanning speed of the high-performance scanner.
* The throughput achieved in printing photovoltaic cell fingers.
* The dynamic pitch control capabilities of the system.
š **Clip Abstract** This segment focuses on the high-speed scanner used in the laser transfer equipment, emphasizing its 350 Hz scanning frequency and its ability to print 150 fingers on a photovoltaic cell in under one second. It also highlights the dynamic pitch control feature, enabling adjustments to the printed pattern.
š Link in comments š
#HighSpeedScanner, #LaserTransfer, #DynamicPitchControl, #PVCellFingers, #Photovoltaics, #SolarCellManufacturing
This is a highlight of the presentation:
Laser Pattern Transfer Printing for High-Viscosity Pastes: Enabling Future Challenges in Microelectronics, Advanced Packaging & Photovoltaic.
More Highlights from the same talk.
00:03:41 - 00:03:52
How does the laser-induced forward transfer (LIFT) process achieve sub-micron interface reactions?
How does the laser-induced forward transfer (LIFT) process achieve sub-micron interface reactions?
The laser transfer process relies on laser-induced forward transfer (LIFT) to deposit conductive patterns. This involves creating a highly localized, sub-micron interface reaction. This reaction occurs between the laser energy, the paste material, and the sidewalls of the trench in the patterned carrier.
The focused laser energy induces a rapid, localized heating and phase change in the paste material at the interface with the carrier. This localized energy input causes the paste to detach from the carrier and transfer onto the target substrate in a controlled manner. The precision of the laser allows for the creation of very fine lines and high-resolution patterns.
The speaker emphasizes that this process enables the release of a finger onto a photovoltaic cell or any other conductive pattern in a single shot. This is a non-contact technology, allowing for the creation of very fine lines, such as 10-micron lines with a 16-micron pitch, using conventional photovoltaic silver paste.
In this short video, you can learn:
* How laser-induced forward transfer (LIFT) is used for precise material deposition.
* The importance of sub-micron interface reactions in the transfer process.
* The capabilities of the technology in creating fine lines and high-resolution patterns.
š **Clip Abstract** This segment details the core mechanism of the laser transfer printing technology, focusing on the laser-induced forward transfer (LIFT) process and its ability to create sub-micron interface reactions for precise material deposition. It highlights the non-contact nature of the technology and its capacity for achieving fine lines and high-resolution patterns.
š Link in comments š
#LaserInducedForwardTransfer, #SubMicronInterface, #PrecisionDeposition, #ConductivePrinting, #Photovoltaics, #PrintedElectronics
00:09:10 - 00:09:23
How does "digital PTP" bridge the gap between conventional additive manufacturing and photolithography in advanced packaging?
How does "digital PTP" bridge the gap between conventional additive manufacturing and photolithography in advanced packaging?
The speaker introduces the concept of "digital PTP" (Pattern Transfer Printing) as a solution to address the cost challenges in advanced packaging. As bump pitches decrease below 50 microns, conventional additive manufacturing techniques like stencil dispensing and ball dropping become inadequate. This necessitates the use of expensive photolithography and electroplating processes, significantly increasing the cost of packaging.
Digital PTP aims to fill the gap between these two approaches. It offers a cost-effective alternative for applications requiring resolutions beyond the capabilities of conventional additive manufacturing but without the high costs associated with photolithography. The technology leverages the precision of laser transfer printing to achieve the desired resolution at a lower cost.
The speaker emphasizes that digital PTP is designed to provide a balance between resolution and cost, making it a viable option for advanced packaging applications where traditional methods are either insufficient or too expensive. This approach allows for the creation of micro cavities for bumps with solder paste, offering a cost-effective solution for fine-pitch packaging.
In this short video, you can learn:
* The limitations of conventional additive manufacturing in advanced packaging.
* The cost implications of using photolithography for fine-pitch applications.
* How digital PTP offers a cost-effective alternative for bump pitches below 50 microns.
š **Clip Abstract** This segment introduces the concept of "digital PTP" as a cost-effective solution for advanced packaging, bridging the gap between conventional additive manufacturing and expensive photolithography for bump pitches below 50 microns. It highlights the technology's potential to reduce costs while maintaining the required resolution.
š Link in comments š
#DigitalPTP, #PatternTransferPrinting, #LaserTransferPrinting, #FinePitchPackaging, #AdvancedPackaging, #SemiconductorManufacturing