Fabian Schnegg | Nextflex: What fixturing techniques are used to enable double-sided component assembly on flexible substrates?
00:09:44 - 00:10:07
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Summary of the clip:
What fixturing techniques are used to enable double-sided component assembly on flexible substrates?
The speaker discusses the complexities of assembling components on both sides of a flexible substrate. They explain that front-side assembly often requires nesting the device within a fixture. These fixtures are designed with pockets to accommodate previously assembled components on the back side.
To facilitate back-side assembly, the fixtures incorporate pedestals that support the substrate in areas where components still need to be placed. These pedestals are strategically positioned to allow access for assembly processes. This ensures that components on both sides can be accurately placed and secured.
In their specific implementation, the pedestals are equipped with vacuum holes to maintain a flat substrate surface. This is particularly important for dispensing processes, where consistent proximity to the substrate is crucial for accurate material deposition. The vacuum-assisted fixturing ensures a stable and reliable assembly process.
In this short video, you can learn:
* The need for specialized fixtures when assembling components on both sides of a flexible substrate.
* The use of pockets and pedestals in fixtures to accommodate existing components and provide support for assembly.
* The integration of vacuum holes in pedestals to maintain substrate flatness during dispensing.
π **Clip Abstract** This segment describes fixturing techniques for double-sided component assembly on flexible substrates. Pockets, pedestals, and vacuum holes are used to ensure accurate component placement and substrate stability.
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#FlexibleSubstrateFixtures, #DoubleSidedAssembly, #VacuumPedestals, #DispensingProcess, #FlexibleElectronics, #AdvancedPackaging
This is a highlight of the presentation:
State of the Art in Additive Hybrid Electronics by NextFlex and its Partners
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00:07:08 - 00:07:22
What are the trade-offs between via formation methods in printed electronics?
What are the trade-offs between via formation methods in printed electronics?
The speaker discusses the creation of vias in two-layer printed flex devices. Laser cutting is used to create vias ranging from 80 to 150 microns in diameter, depending on the ink. Most inks will fill the via during trace printing, but some require an additional stencil print step directly into the via before trace printing.
The process of filling vias is critical for establishing electrical connectivity between layers. While many inks naturally fill the vias during the trace printing process, certain inks necessitate an additional step involving stencil printing directly into the vias. This ensures a robust and reliable connection between the layers, which is essential for the overall functionality of the printed electronic device.
The speaker notes that while their via formation process yields high results and low via resistance, it is not perfect. To mitigate potential issues, they have implemented redundancy in their latest designs by doubling up on vias to ensure a solid connection. This approach enhances the reliability and robustness of the printed electronic devices.
In this short video, you can learn:
* The typical size range of laser-cut vias in printed electronics.
* The necessity of additional stencil printing for certain inks to ensure proper via filling.
* The importance of via redundancy to improve connection reliability.
π **Clip Abstract** This segment details via creation in two-layer printed flex circuits, highlighting laser cutting and ink-filling techniques. Redundancy is implemented to ensure reliable connections.
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#ViaFormation, #LaserAblation, #StencilPrinting, #PrintedElectronics, #FlexibleElectronics, #AdvancedPackaging
00:08:15 - 00:08:36
How does laser ablation compare to direct screen printing for fine feature creation in printed electronics?
How does laser ablation compare to direct screen printing for fine feature creation in printed electronics?
The speaker addresses the challenges of SMT assembly, particularly for components with fine pad spacing like PGA components. They describe a technique where a solid layer is printed first, followed by laser ablation to create the desired structure. This method is presented as an alternative to direct screen printing for achieving fine features.
Direct screen printing can be used to create fine structures, but it typically results in a much lower thickness. This lower thickness can lead to a challenging topography for assembly, as well as mechanically less robust traces, especially for narrow lines. Additionally, the reduced cross-section of these thinner traces can result in higher resistance.
Laser ablation, on the other hand, allows for maintaining a consistent thickness because the entire layer is printed uniformly before ablation. This results in a more even topography, which is beneficial for assembly. The speaker suggests that while direct screen printing is possible, laser ablation offers advantages in terms of mechanical robustness, resistance, and assembly ease.
In this short video, you can learn:
* The challenges of screen printing fine features for SMT assembly.
* The benefits of using laser ablation to create fine structures after printing a solid layer.
* The impact of trace thickness on mechanical robustness and electrical resistance.
π **Clip Abstract** This segment compares laser ablation and direct screen printing for creating fine features in printed electronics. Laser ablation is favored for maintaining consistent thickness and improving assembly.
π Link in comments π
#LaserAblation, #ScreenPrinting, #PrintedElectronics, #FineFeatureFabrication, #SemiconductorPackaging, #AdvancedManufacturing