Gabriela Pereira | Yole Group: Why is advanced packaging projected to dominate over 58% of the market by 2029?
08:51.885 - 10:06.005
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Why is advanced packaging projected to dominate over 58% of the market by 2029?
The fundamental role of packaging is evolving. It's no longer just about mechanical protection and encapsulation for semiconductor devices. The industry is strategically shifting towards using the package itself as a tool for performance enhancement, complementing or even replacing costly front-end node scaling.
This transition is driven by the relentless performance demands of next-generation applications. Megatrends like generative AI and high-performance computing (HPC) require massive data throughput and integration, which can be achieved at the package level. Similarly, 5G networking, high-end mobile devices, and the complex systems in autonomous vehicles all rely on advanced packaging to meet their performance, power, and form factor requirements.
As a result, the market share for advanced packaging is rapidly overtaking traditional methods. Starting from 46% in 2019, it's expected to reach nearly 50% in 2024 and surge to a dominant 58% by 2029. This financial trend underscores a deep technical shift where the package is now an integral part of the system's performance equation.
In this short video, you can learn:
* The strategic shift from "protection" to "performance enhancement" in semiconductor packaging.
* Key market drivers like GenAI, HPC, and autonomous driving fueling this trend.
* Market projections showing advanced packaging capturing a 58% revenue share by 2029.
š **Clip Abstract** Advanced semiconductor packaging is rapidly overtaking traditional methods, projected to capture 58% of the market by 2029. This growth is driven by a strategic shift where the package is no longer just for protection but is crucial for enhancing system performance in demanding applications like AI and 5G.
š Link in comments š
#AdvancedPackaging, #PerformanceEnhancement, #PackageLevelIntegration, #FrontEndNodeScaling, #SemiconductorTechnology, #3DElectronics
This is a highlight of the presentation:
Advanced Packaging at a Glance: Market Trends, Technology, and Challenges
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11:23.705 - 13:08.005
Chiplets, hybrid bonding, co-packaged optics... are these just buzzwords, or the real future of high-performance electronics?
Chiplets, hybrid bonding, co-packaged optics... are these just buzzwords, or the real future of high-performance electronics?
To keep pace with Moore's Law at the system level, advanced packaging must deliver on several key performance vectors: lower power consumption, superior thermal management, and higher speed interconnects for increased bandwidth. This requires continuous innovation in how we design and assemble packages, pushing the boundaries of integration density and signal integrity.
This has led to a roadmap of transformative technologies. Heterogeneous integration and chiplet-based designs are becoming standard, allowing for the assembly of multiple specialized dies in a single package to optimize cost and performance. To connect these chiplets, technologies like hybrid bonding are enabling ultra-fine pitch interconnects, dramatically increasing I/O density and speed.
Beyond electrical interconnects, the industry is exploring new frontiers. Co-packaged optics (CPO) and silicon photonics are being integrated to overcome the bandwidth limitations of copper. At the substrate level, new materials like glass core are being developed to provide better dimensional stability and electrical performance for increasingly large and complex packages, while panel-level processing promises cost efficiencies for these larger form factors.
In this short video, you can learn:
* The core performance requirements driving packaging innovation: power, thermal, and bandwidth.
* An overview of key enabling technologies like heterogeneous integration, chiplets, and hybrid bonding.
* Emerging trends including co-packaged optics (CPO) and novel substrate materials like glass core.
š **Clip Abstract** The future of high-performance electronics hinges on a suite of advanced packaging innovations designed to boost performance and bandwidth. This clip explores the technology roadmap, from chiplet integration and hybrid bonding to emerging frontiers like co-packaged optics and glass core substrates.
š Link in comments š
#Chiplets, #HybridBonding, #CoPackagedOptics, #GlassCoreSubstrates, #AdvancedPackaging, #HighPerformanceComputing
13:07.985 - 15:45.495
Can additive manufacturing overcome its challenges to revolutionize how we build advanced semiconductor packages?
Can additive manufacturing overcome its challenges to revolutionize how we build advanced semiconductor packages?
While not yet a mainstream topic at major packaging conferences, additive manufacturing is an emerging and powerful approach for fabricating next-generation packages. It offers unique advantages, particularly for customized, small-volume applications, by enabling the direct integration of electrical components with printed structures. This can eliminate external wiring, reduce assembly complexity, and minimize material waste compared to traditional subtractive processes.
The potential applications for additive electronics within advanced packaging are diverse and impactful. They include the direct printing of high-density package interconnects like redistribution layers (RDLs), embedded antennas, and even optical interconnects. Additive techniques can also be used for package encapsulation, creating structures like through-mold vias (TMVs), and for fabricating complex buildup layers and vias on IC substrates and PCBs.
However, significant technical hurdles remain before widespread adoption. Key challenges include ensuring long-term reliability, establishing industry standards, and developing a robust ecosystem of specialized materials like metallic inks and photo-sensitive polymers. Engineers must also solve process-related issues such as controlling surface roughness, managing warpage from dissimilar materials, and overcoming the resolution constraints of current printing technologies.
In this short video, you can learn:
* The emerging role of additive manufacturing in advanced packaging for customization and integration.
* Specific applications including printed RDLs, embedded antennas, and through-mold vias.
* The key technical challenges that must be addressed, from reliability and materials to process control.
š **Clip Abstract** Additive manufacturing is poised to bring new capabilities to advanced packaging, enabling direct printing of interconnects, antennas, and other complex structures. This clip details the key applications and advantages, while also providing a realistic look at the significant reliability, material, and process challenges that must be overcome.
š Link in comments š
#AdvancedPackaging, #AdditiveManufacturing, #RedistributionLayers, #ThroughMoldVias, #ElectronicsManufacturing, #3DElectronics