Gurvinder Singh Khinda | GE Healthcare: Why does directly printing a standard PCB Gerber file with conductive inks fail in production?
00:08:53 - 00:10:22
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Summary of the clip:
Why does directly printing a standard PCB Gerber file with conductive inks fail in production?
The industry standard approach of treating flexible hybrid electronics (FHE) like conventional subtractive PCBs is a major technical bottleneck. Designers frequently take Gerber files intended for subtractive copper clads and simply direct-print them using silver conductive inks, expecting identical electrical and mechanical performance.
This copy-paste design strategy fails because printed inks do not possess the same stable, thick conductivity profiles as solid copper clads. Power and charging modules have highly specific electrical demands that cannot be met without adapting the physical trace geometries to the exact ink material kit being printed.
Compounding this issue is the lack of robust, real-time monitoring tools capable of identifying printed trace defects or establishing flexible-specific design rules. This gap in defect detection prevents manufacturers from optimizing yield and reliably scaling printed electronics.
In this short video, you can learn:
* Why traditional subtractive Gerber files are incompatible with direct-printed additive electronic processes.
* How electrical demand variations in power and charging modules conflict with printed ink limitations.
* The critical role of monitoring and defect detection tools in setting design rules for flexible substrates.
π **Clip Abstract** This clip highlights the translation deficit when converting subtractive PCB designs directly into printed flexible hybrid electronics. It explains why simple material substitution fails to deliver expected electrical performance without customized trace geometries.
π Link in comments π
#FlexibleHybridElectronics, #PrintedElectronics, #ConductiveInks, #TraceGeometry, #AdditiveDesignRules, #DefectDetection
This is a highlight of the presentation:
Sustainability-to-Scalability in FHE: Screening LCA Insights and AI/ML-Enabled Manufacturing
Future of Electronics RESHAPED USA 2026
10-11 June 2026
Computer History Museum, Mountain View, California, USA
Organised By:
TechBlick
More Highlights from the same talk.
00:06:07 - 00:08:32
Why is silver ink actually a sustainability disaster for flexible hybrid electronics?
Why is silver ink actually a sustainability disaster for flexible hybrid electronics?
Evaluating additive versus subtractive manufacturing processes reveals a stark difference in environmental impact. A printed flexible circuit offers a 20% to 40% lower footprint across key categories, heavily driven by reductions in water scarcity and energy demand since subtractive chemical etching generates massive material waste.
However, substituting copper for silver inks yields the most dramatic improvement. Silver-based inks carry a 38% higher environmental penalty due to the high energy intensity of silver extraction and its high toxicity when released into aquatic ecosystems, making copper a much greener alternative.
Furthermore, assembly materials dictate the ultimate footprint of single-use medical patches. Transitioning from standard SAC305 to low-temperature solders or conductive epoxies with lower curing temperatures significantly slashes manufacturing emissions, pointing the way toward highly sustainable, single-use medical wearables.
In this short video, you can learn:
* The quantified environmental benefits of printed additive flex circuits over traditional subtractive processing.
* Why silver inks pose significantly higher ecological and cost penalties compared to copper-based alternatives.
* How low-temperature soldering and conductive adhesive choices minimize carbon footprint in assembly.
π **Clip Abstract** This clip compares the life cycle assessment (LCA) profiles of additive printed electronics and traditional subtractive flexible circuits. It details how selecting copper inks and low-temperature solders instead of silver-based systems drastically reduces water and energy consumption.
π Link in comments π
#CopperInks, #LowTemperatureSoldering, #LifeCycleAssessment, #PrintedElectronics, #FlexibleHybridElectronics, #MedicalWearables
00:10:22 - 00:12:29
How can foundation models and closed-loop machine learning bridge the gap between standard flexible circuits and high-yield printed electronics?
Transitioning from conventional copper-clad flexible substrates to additive printed electronics requires a complex re-evaluation of design rules. To bypass tedious empirical trials, advanced machine learning models can ingest material kit characteristics and target conductivities to predict optimal trace dimensions and deposition parameters. This predictive approach establishes a robust digital foundation, accelerating the R&D cycle while minimizing the consumption of expensive functional inks and substrates.
In the production phase, integrating these AI tools into a closed-loop manufacturing system enables real-time defect mitigation and continuous process optimization. By feeding in-line inspection data back into the model, the system dynamically refines design rules and printing parameters on the fly. This tight integration of predictive design and adaptive manufacturing ensures that printed assemblies achieve the rigorous performance benchmarks of standard flex circuits at a fraction of the cost.
In this short video, you can learn:
* How AI and machine learning tools are being applied to establish design rules when converting standard flex circuits to printed alternatives.
* The role of foundation models in predicting printing techniques and process parameters based on specific material kits and target conductivities.
* How closed-loop manufacturing systems leverage defect data to optimize design rules and guarantee targeted performance in final assemblies.
π **Clip Abstract** The speaker proposes a machine learning framework divided into a design phase for predicting printing parameters and a closed-loop manufacturing phase for defect elimination. This AI-driven approach aims to match the performance of standard flexible circuits while reducing R&D cycle times, material waste, and overall production costs.
π€ Speaker: Gurvinder Singh Khinda
π’ Company: GE Healthcare
π
Event: Future of Electronics RESHAPED USA 2026
π Location: Computer History Museum, Mountain View, California, USA
π Learn more at the next TechBlick event: https://www.techblick.com
#PerovskiteSiliconTandem, #MicroLEDLightEngines, #DiffractiveWaveguides, #RollToRollPrinting, #FlexibleOptoelectronics, #AugmentedRealityHardware