Hervé Javice | ioTech Group: Can additive 3D printing replace electroplating for high-density flip-chip bumping at scale?
00:11:06 - 00:12:47
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Summary of the clip:
Can additive 3D printing replace electroplating for high-density flip-chip bumping at scale?
The fabrication of high-aspect-ratio 3D microstructures, such as copper pillars for flip-chip assemblies, typically requires complex, chemical-heavy electroplating processes. CLAD presents a green alternative by directly stacking distinct functional materials to grow 3D micro-bumps. In a single run, the tool can deposit copper, silver, nickel, and protective organic layers sequentially on the same site.
This additive process produces 70-micron diameter, 85-micron height pillars with exceptional structural integrity and aspect ratio control. Operating at a throughput of 1 million pillars per hour, the system bridges the speed gap usually associated with additive techniques. It provides semiconductor manufacturers a highly localized, dry alternative to wet chemistry.
Importantly, the technology works on both standard 200mm wafers and already-singulated dies, offering unmatched flexibility for prototyping and high-mix packaging. By eliminating lithographic masks and seed layer etching, it dramatically cuts down the keep-out zones and simplifies the backend packaging workflow.
In this short video, you can learn:
* How multi-material stacking of copper, silver, and nickel creates functional flip-chip bumps without mask layers.
* The throughput and geometric parameters achieved during dry, maskless bumping on 200mm wafers.
* Why localized additive deposition serves as a high-density, sustainable alternative to wet electroplating.
📋 **Clip Abstract**
This clip showcases a practical application of CLAD in semiconductor packaging, specifically the maskless printing of copper pillar bumps. It outlines how a multi-material stack of copper, silver, and nickel is built up to 85 microns in height at a rate of 1 million pillars per hour.
#CopperPillarBumping, #MasklessBumping, #AdditiveMetallization, #FlipChipAssembly, #AdvancedPackaging, #HeterogeneousIntegration
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00:03:03 - 00:04:43
How can laser-assisted deposition bypass nozzle clogging and mask requirements while printing down to 40 microns?
How can laser-assisted deposition bypass nozzle clogging and mask requirements while printing down to 40 microns?
Continuous Laser Assisted Deposition (CLAD) leverages a nozzle-less, non-contact mechanism to achieve high-resolution additive manufacturing. By applying a precise, thin coating of material onto a moving carrier foil, the system eliminates traditional printing bottlenecks. A galvanometer scanner then selectively jets droplets using laser pulses, projecting material onto the substrate.
This architectural shift from traditional inkjet and dispensing architectures removes the typical constraints of viscosity, mesh clog, and mask alignment. The system achieves high throughput with droplet generation speeds in the thousands of hertz. It is designed to bridge the gap between low-throughput micro-dispensing and low-resolution screen printing.
Furthermore, integrating in-situ post-processing capabilities allows for dynamic manufacturing of complex, multi-layered devices. By embedding UV curing, thermal curing, laser sintering, and selective laser ablation directly into the printing cycle, the system handles complex material stacks in a single tool.
In this short video, you can learn:
* How the carrier foil and scanner configuration eliminate nozzle-clogging vulnerabilities in high-viscosity deposition.
* The operational parameters for achieving 40-micron resolution at production-level speeds.
* How integrated post-processing like laser sintering and ablation creates an all-in-one additive manufacturing station.
📋 **Clip Abstract**
This clip explains the operational principles of Continuous Laser Assisted Deposition (CLAD), demonstrating how a foil-and-scanner assembly replaces traditional nozzles. It details how the integration of in-line laser sintering, curing, and ablation enables high-speed, non-contact printing down to 40 microns.
#ContinuousLaserAssistedDeposition, #NozzlelessPrinting, #LaserDirectWrite, #SelectiveLaserAblation, #PrintedElectronics, #AdditiveMicroelectronics
00:19:01 - 00:20:53
How do you transition Laser Induced Forward Transfer (LIFT) from a 30-year-old lab concept into a robust high-volume semiconductor fab tool?
How do you successfully transition a highly promising but notoriously unstable laser-induced forward transfer process from a controlled laboratory environment to a high-throughput semiconductor fabrication facility?
While laser-induced forward transfer (LIFT) is a known method for precise material deposition, commercialization has been bottlenecked by fluid dynamics and beam-material interactions. The primary challenge lies in stabilizing transfer mechanics to achieve the repeatability, speed, and yield required for industrial electronics manufacturing.
Overcoming these barriers requires understanding laser-material interactions when transitioning from solid donor layers to complex fluids. Early industrial LIFT focused on solid copper deposition for PCB repair. However, adapting this to functional fluids demands sophisticated control over jetting dynamics, pulse synchronization, and donor-substrate spacing to prevent satellite droplets and ensure uniform deposition.
Securing a market position in this additive manufacturing landscape requires a robust intellectual property strategy. While foundational LIFT physics are public, the proprietary hardware, beam-shaping optics, and fluid-handling systems enabling high-yield production represent the true frontier. Leaders rely on patent portfolios to safeguard the system architectures making high-speed, multi-material LIFT commercially viable.
In this short video, you can learn:
* The historical engineering bottleneck that prevented laser-induced forward transfer (LIFT) from transitioning from the laboratory to industrial fabrication.
* How early solid-state copper deposition techniques for PCB repair laid the groundwork for modern fluid-based laser transfer systems.
* The critical role of proprietary system architectures and robust patent portfolios in establishing market leadership for advanced additive electronics.
📋 **Clip Abstract**
The speaker addresses a question regarding potential patent infringement and the historical origins of laser-induced forward transfer (LIFT) technology. He explains how his partner leveraged experience in solid copper PCB repair to successfully adapt LIFT for fluid deposition, securing dozens of patents to establish their position at the forefront of the industry.
🎤 Speaker: Hervé Javice
🏢 Company: ioTech Group
📅 Event: The Future of Electronics RESHAPED 2023 Berlin
📍 Location: Estrel Congress Centre, Berlin, Germany, Europe
🌐 Learn more at the next TechBlick event: https://www.techblick.com
#LaserInducedForwardTransfer, #HighViscosityJetting, #PanelLevelPackaging, #GalvanometerScanning, #PrintedElectronics, #AdvancedPackaging