Irving Rodriguez | Essemtec: Your $50,000 BGA failed. Is there a reliable, automated way to re-ball it without the risks of manual stenciling or complex laser setups?
00:08:08 - 00:09:59
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Summary of the clip:
Your $50,000 BGA failed. Is there a reliable, automated way to re-ball it without the risks of manual stenciling or complex laser setups?
Re-balling high-value Ball Grid Arrays (BGAs), which can cost upwards of $50,000, is a critical process for salvaging expensive components and is a specialized business in itself. This clip details a highly reliable, automated workflow that replaces manual, error-prone methods. The process involves loading the BGA, using a high-speed jetting head to precisely dispense flux onto each pad, and then using a robotic pick-and-place head to accurately place individual solder bumps, which are conveniently supplied on a standard SMT reel.
This automated jetting and placement method is technically superior to other common re-balling techniques. It offers a dramatic improvement in speed, repeatability, and reliability compared to the traditional manual process, which involves using a physical stencil for flux and hand-placing the solder spheres. Furthermore, it avoids the process complexities and material limitations of laser-based systems, which require careful tuning of laser power to the specific solder alloy and are often slower than the jetting approach.
The quantifiable results of this automated process underscore its manufacturing-level quality and control. Following the re-balling and reflow process, measurements show that the height of a 500-micron solder bump is maintained within a tight tolerance of plus or minus 25 microns. This exceptional consistency in bump height is crucial for ensuring high yields and reliable connections when the refurbished BGA is ultimately mounted onto a new printed circuit board.
In this short video, you can learn:
* An automated workflow for BGA re-balling using flux jetting and pick-and-place.
* A technical comparison of three different re-balling methods: automated jetting, laser soldering, and manual stenciling.
* The achievable post-reflow solder bump height consistency (Ā±25 microns) using an automated process.
š **Clip Abstract** This clip details an automated process for re-balling high-value BGAs, a critical task for salvaging components worth up to $50,000. It compares the speed and reliability of using high-speed flux jetting and robotic ball placement against manual and laser-based methods, highlighting superior consistency with a final bump height variation of just Ā±25 microns.
š Link in comments š
#BGAReballing, #FluxJetting, #SolderBumpPlacement, #AutomatedElectronicsAssembly, #MicroElectronicsAssembly, #PrecisionManufacturing
This is a highlight of the presentation:
Enhancing circular economy by facilitating the repair of electronic components
More Highlights from the same talk.
00:04:21 - 00:05:48
How do you combine solder jetting, glue dispensing, and pick-and-place in a single machine for rapid PCB repair and prototyping?
How do you combine solder jetting, glue dispensing, and pick-and-place in a single machine for rapid PCB repair and prototyping?
This clip introduces an advanced, all-in-one platform designed for high-precision electronics repair, enhancement, and production. The system moves beyond traditional, cumbersome methods like manual stenciling by integrating multiple core SMT processes into a single, automated machine. This consolidation of technology allows for a seamless workflow, from material deposition to component placement, all controlled by intelligent software and vision systems.
The core of the platform's flexibility lies in its multiple dispensing and placement heads. It features high-speed solder jetting, which enables stencil-free, precise application of solder paste directly onto the pads, accommodating even the finest pitches. This is complemented by glue jetting for component adhesion and a high-accuracy pick-and-place module that handles a wide range of components, including challenging parts like 01005s, all within the same machine and the same production run.
The demonstrated workflow showcases the system's efficiency in a typical repair scenario. The machine uses its integrated vision system to automatically recognize the target location on the PCB. It then jets the exact volume of solder paste required for each pad before precisely picking and placing the new component. This entire sequence is automated, significantly reducing operator dependency and dramatically increasing the speed, reliability, and repeatability of complex repair tasks.
In this short video, you can learn:
* The core capabilities of an all-in-one SMT repair and production system.
* How solder jetting technology enables stencil-free application of solder paste.
* The automated workflow for component replacement, from paste deposition to final placement.
š **Clip Abstract** This clip introduces a multi-process system that integrates solder jetting, adhesive dispensing, and component placement for automated electronics repair. The technology eliminates the need for stencils, increasing speed, precision, and flexibility, especially for high-density boards.
š Link in comments š
#SolderJetting, #GlueDispensing, #PickAndPlace, #StencilFreeSMT, #AdditiveElectronics, #AdvancedElectronicsManufacturing
00:04:23 - 00:05:06
How does "jetting on the fly" impact material selection and process control?
How does "jetting on the fly" impact material selection and process control?
The speaker highlights a key specialty of their machines: "jetting on the fly." This involves dispensing material while the machine is in motion, achieving a speed of approximately 1.1 million dots per hour, which translates to about 300 Hz. This high-speed jetting capability is complemented by a variable jetting height feature.
The variable jetting height is particularly important when dealing with substrates that have cavities or are uneven. The machine maintains a specific distance between the jetting nozzle and the PCB, avoiding contact. This non-contact approach is crucial for ensuring consistent and accurate material deposition on complex or irregular surfaces.
This combination of high-speed "jetting on the fly" and variable jetting height allows for efficient and precise material application in various scenarios, especially where substrate topography presents a challenge. This capability enhances the machine's versatility and suitability for a wider range of applications in printed electronics and SMT assembly.
In this short video, you can learn:
* The concept of "jetting on the fly" for high-speed dispensing.
* The importance of variable jetting height for uneven substrates.
* How these features contribute to efficient and precise material deposition.
š **Clip Abstract** This segment introduces "jetting on the fly," a high-speed dispensing technique, and emphasizes the significance of variable jetting height for handling uneven surfaces. These features enhance the precision and efficiency of material deposition in printed electronics and SMT assembly.
š Link in comments š
#JettingOnTheFly, #VariableJettingHeight, #HighSpeedDispensing, #NonContactDeposition, #PrintedElectronics, #SMTAssembly
00:05:50 - 00:07:12
Can you accurately jet solder paste for a 400-micron pitch QFP right next to a 1mm deep cavity on the same board?
Can you accurately jet solder paste for a 400-micron pitch QFP right next to a 1mm deep cavity on the same board?
This case study presents a challenging real-world repair application: replacing a Quad Flat Package (QFP) on an automotive Anti-lock Braking System (ABS) module. The difficulty stems from the complex topography and mixed feature sizes on the board. The repair area includes extremely fine-pitch pads (400 microns), a large central heat dissipation area with a topography variation of 1 millimeter, and other large flat-pack pads, all requiring precise solder paste deposition.
The technical solution leverages the power of advanced solder jetting to overcome these challenges. For the 400-micron fine-pitch pads, the system dispenses highly precise 260-micron diameter dots of solder paste. This is achieved with an exceptional XY placement accuracy of 20-24 microns at 3 sigma, which is critical to prevent solder bridging and ensure perfect joint formation on such tightly spaced features, even when dispensing next to deep cavities.
To optimize the process for the entire component, the system intelligently adapts its dispensing strategy. While maintaining high precision for the fine-pitch I/O, it switches to a high-throughput jetting mode for the larger central pads and heat dissipation areas. In this mode, it dispenses larger, 670-micron dots at a much higher speed, demonstrating the ability to dynamically adjust parameters to efficiently handle both fine-pitch precision and large-volume deposition within a single, automated repair cycle.
In this short video, you can learn:
* How to tackle solder paste deposition on boards with complex, multi-level topography.
* The specific jetting parameters (dot size, accuracy) required for reliable 400-micron pitch repair.
* The use of different jetting modes to optimize for both fine-pitch precision and high-throughput on a single device.
š **Clip Abstract** This case study demonstrates the repair of a fine-pitch QFP on a complex automotive module with significant topography. It highlights how solder jetting technology achieves high precision (20-micron accuracy) for 400-micron pitch pads while also accommodating large features, all in a single automated process.
š Link in comments š
#SolderJetting, #FinePitchSoldering, #PrecisionDispensing, #ComplexTopography, #AdditiveElectronics, #AutomotiveElectronics