Jan Gülink | QubeDot: How do you build a 0.5-inch transparent micro-LED display with 250 segments and over 10 million nits?
03:31 - 04:44
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Summary of the clip:
How do you build a 0.5-inch transparent micro-LED display with 250 segments and over 10 million nits?
The display goes down to five micrometres of LED size, with roughly 250 segments on a 0.5-inch diagonal, and here more than 10 million nits have been achieved. That combination of segment count, sub-ten-micrometre emitters and extreme luminance defines the device. The architecture places all segments in the middle, with outer contact pads allowing the die to be positioned wherever board space is available.
How does it work at the end? It is a BGA-like component: you know BGA components from electronics, where you can just set one onto your PCB or onto your interposer, and this is kind of the same here. So we have a display with all segments in the middle and some outer contact pads that you can place with every place that you have available.
This can be integrated either in transparent mode, as shown, where you can actually look through the gallium-nitride-on-sapphire transparent monolithic display, or, due to its high brightness, in a classical projection solution. The device is produced in Europe, from the company's own site. Such a high-brightness, transparent monolithic micro-LED layout is what the classical technologies needed here require.
In this short video, you can learn:
* LED size reaches five micrometres, with about 250 segments on a 0.5-inch diagonal and more than 10 million nits achieved.
* The package is BGA-like, with all segments in the middle and outer contact pads placeable wherever PCB or interposer space exists.
* The gallium-nitride-on-sapphire transparent monolithic display also suits classical projection thanks to its brightness, and is produced in Europe.
📋 **Clip Abstract** A 0.5-inch diagonal display with roughly 250 segments, five-micrometre LEDs and over 10 million nits is built as a BGA-like component that drops onto a PCB or interposer. It runs either as a transparent gallium-nitride-on-sapphire monolithic display or, because of its high brightness, in classical projection, with production in Europe.
About the speaker:
* Speaker: Jan Gülink
* Company: QubeDot
* Event: Eindhoven 2026
* Location: High Tech Campus, Eindhoven
#MicroLEDSegments, #GalliumNitrideOnSapphire, #TransparentMonolithicDisplay, #BGAIntegration, #MicroLEDDisplays, #ProjectionDisplays
This is a highlight of the presentation:
Large-area CMOS MicroLED Displays
More Highlights from the same talk.
05:36 - 07:14
Why did micro-LEDs fail to become the universal display technology, and where does 75% of manufacturing sit?
Why did micro-LEDs fail to become the universal display technology, and where does 75% of manufacturing sit?
The announcement was based on LCOS and reflective waveguides rather than micro-LEDs, and that brought the mood down last year. By 2026 there are many diverse players for everyday AR glasses, all offering monochrome micro-LED light engines in real products — think Urealities, think Rokid. China and Taiwan are the centre of gravity for that supply.
Micro-LEDs are not the universal next display technology that everyone thought about five, six or seven years ago, simply because the industry touched manufacturing reality. Most smart glasses are sold with all displays, and most micro-LED light engines aim at an 0.1-inch size, both to have the costs and to be integrated into wearables or the frames of glasses.
Seventy-five percent of the manufacturing capacity for micro-LEDs can be found, for example, in China or Taiwan, while Europe is only in the single digits. That raises two main questions: what about Europe, and what about larger displays if everybody is for the B2C products? Those two questions matter for Europe's role in capacity and for whether micro-LEDs move beyond small light engines.
In this short video, you can learn:
* Seventy-five percent of micro-LED manufacturing capacity can be found in China or Taiwan, with Europe in the single digits.
* Everyday AR glasses from Urealities, Rokid and others offer monochrome micro-LED light engines in real products.
* Micro-LEDs are not the universal next display technology expected five to seven years ago, because the industry touched manufacturing reality.
📋 **Clip Abstract** Last year's LCOS and reflective-waveguide announcement brought the mood down, but by 2026 everyday AR glasses from players such as Urealities and Rokid ship monochrome micro-LED light engines. With 75% of micro-LED manufacturing capacity in China or Taiwan and Europe in single digits, the open questions are Europe's role and whether micro-LEDs can serve larger displays beyond B2C products.
About the speaker:
* Speaker: Jan Gülink
* Company: QubeDot
* Event: Eindhoven 2026
* Location: High Tech Campus, Eindhoven
#MicroLEDLightEngines, #MonochromeMicroLED, #ZeroPointOneInch, #ReflectiveWaveguides, #ARDisplay, #MicroLED
14:05 - 16:26
Can a solder-bump direct lift place a 14 µm microLED on the final backplane in one transfer step?
Can a solder-bump direct lift place a 14 µm microLED on the final backplane in one transfer step?
Direct lift bumps the final carrier and shoots the micro-LED straight onto it, so mechanical stability and electrical contact are established directly. The key enabler is the solder bump material, developed over recent years, which tolerates the high energy release applied at the beginning to the real backplane. Cutting intermediate structures lowers cost per LED transfer, making the approach an affordable alternative to conventional routes.
The concrete demonstration uses LED dies of 14 by 14 micrometres with a triangular contact configuration and a high aspect ratio. Transferred to different backplanes, flip chips show defect-free interconnects, and this is described as the closest configuration for small-pitch interposers. For spreading onto larger backplanes, the targets are LTPS, TFT and typical PCBs, with die pitches beyond 100 micrometres.
From LED wafer to backplane the process needs exactly one transfer step, with no intermediate steps: electrical contact and mechanical attachment are established in the same operation. Emitter size does not depend directly on LED die size, with the best case larger than five micrometres. Because fewer structures are consumed per transfer, the cost per LED transfer falls as the direct-lift route scales to 100-micrometre pitches.
In this short video, you can learn:
* Direct lift places the micro-LED on the final carrier in one step, establishing electrical contact and mechanical stability with no intermediate carriers.
* A solder-bump material is the key enabler, absorbing high energy release applied directly to the real backplane and lowering cost per transfer.
* Demonstrated dies are 14 by 14 micrometres with triangular, high-aspect-ratio contacts and defect-free flip-chip interconnects suited to small-pitch interposers.
📋 **Clip Abstract** Direct lift is presented as a more affordable micro-LED transfer route: the die is shot straight onto the final carrier and bonded in one step. The enabling solder bump tolerates high energy release applied to the real backplane, and the scheme targets 14 by 14 micrometre dies, pitches beyond 100 micrometres and LTPS, TFT or PCB backplanes.
About the speaker:
* Speaker: Jan Gülink
* Company: QubeDot
* Event: Eindhoven 2026
* Location: High Tech Campus, Eindhoven
#DirectLiftTransfer, #SolderBumpInterconnect, #TriangularContact, #SmallPitchInterposer, #MicroLEDDisplays, #DisplayBackplane
08:51 - 10:22
What does a one-inch, 1920x1200 CMOS-bonded micro-LED display deliver in nits, pitch and refresh rate?
What does a one-inch, 1920x1200 CMOS-bonded micro-LED display deliver in nits, pitch and refresh rate?
QubeDot's solution for larger arrays is a one-inch diagonal CMOS-based micro-LED display: 11 micron pitch, nine micron pixel size, 1,920 by 1,200 resolution, and one million nits. It was built in Europe and produced in Europe within a controlled supply chain. The enabling steps are LED processing and 200-millimeter wafer-to-wafer bonding of the gallium and silicon wafer to the CMOS backplane, keeping yields under control at the large display and die sizes presented.
The one-inch display uses an IPM CMOS backplane. It delivers up to 120 hertz refresh rate and is overall SWaP optimized for the sweet spot of size, weight and power. Depending on APL level, it was measured up to 10 million nits. In principle the backplane can supply up to 40 micron per pixel, giving even more headroom if the thermals are under control and that output is really needed.
The stated numbers fix the trade space: 11 micron pitch and nine micron pixels at 1,920 by 1,200, one million nits and up to 10 million nits measured as APL varies, with 120 hertz refresh. The 40 micron per pixel backplane headroom is explicitly conditional — thermals must be controlled. Yield at these large die sizes is what makes the 200-millimeter wafer-to-wafer bonded CMOS route viable.
In this short video, you can learn:
* A one-inch diagonal CMOS micro-LED display reaches 1,920 by 1,200 resolution at 11 micron pitch with nine micron pixels.
* It runs up to 120 hertz and was measured up to 10 million nits depending on the APL level, alongside one million nits.
* The backplane can supply up to 40 micron per pixel, headroom that is gated by thermal control.
📋 **Clip Abstract** A one-inch diagonal CMOS-based micro-LED display was presented with 11 micron pitch, nine micron pixels, 1,920 by 1,200 resolution, one million nits, and European production inside a controlled supply chain. It bonds gallium and silicon wafers to an IPM CMOS backplane at 200-millimeter wafer-to-wafer scale, runs up to 120 hertz, is SWaP optimized, measures up to 10 million nits depending on APL, and offers 40 micron per pixel headroom if thermals are controlled.
About the speaker:
* Speaker: Jan Gülink
* Company: QubeDot
* Event: Eindhoven 2026
* Location: High Tech Campus, Eindhoven
#WaferToWaferBonding, #CMOSBackplane, #MicronPitchMicroLED, #TenMillionNits, #MicroLEDDisplays, #ARDisplays