Jesus Zozaya | Voltera: How can software compensate for the physical imperfections of multi-layer printing?
13:32 - 15:36
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Summary of the clip:
How can software compensate for the physical imperfections of multi-layer printing?
To address the inherent challenges of multi-layer fabrication, advanced software features are being developed to give users granular process control. This includes the ability to customize toolpaths, adjust the fill density of printed areas, and reorder the print sequence for each layer. This level of control is essential for optimizing the deposition of diverse materials with varying properties onto complex surfaces.
A key innovation is the use of dynamic probing resolution for height mapping. The software is intelligent enough to recognize that while the first layer is flat, subsequent layers introduce topographical features like crossovers. It automatically increases the mapping resolution in these specific, high-variance areas to ensure the nozzle maintains a precise standoff distance—typically around 60 microns—from the now-uneven surface.
The new software also solves the critical problem of alignment between process steps. It is designed to preserve the exact coordinates of the substrate, even after it has been removed for an external process like oven curing. When the substrate is placed back in the machine, the software automatically recalls its precise location, ensuring perfect alignment for the next layer and dramatically speeding up the workflow.
In this short video, you can learn:
* How software provides granular control over toolpaths and print sequences for multi-material printing.
* The concept of dynamic probing resolution for accurately mapping non-planar surfaces.
* A software-based solution for ensuring consistent layer-to-layer alignment after curing steps.
📋 **Clip Abstract** Explore the next-generation software features designed to overcome the core challenges of multi-layer direct-write printing. This clip explains how dynamic height mapping and persistent alignment memory enable high-fidelity, repeatable printing on complex, non-planar surfaces.
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#ProcessControlSoftware, #DynamicHeightMapping, #PersistentAlignment, #DirectWritePrinting, #PrintedElectronics, #AdditiveElectronics
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Multi-layer Printed Battery for Versatile Integration in Wearables, Medical Applications, Smart Packaging, Smart Sensors, and more
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00:01:32 - 00:02:46
Why is transitioning from FR4 copper to flexible hybrid electronics (FHE) so difficult?
Why is transitioning from FR4 copper to flexible hybrid electronics (FHE) so difficult?
Flexible hybrid electronics (FHE) represent a radical shift from traditional rigid printed circuit boards. For electrical engineers accustomed to copper on FR4 substrates, designing FHE from scratch introduces highly complex, unfamiliar materials challenges. These range from choosing the right biocompatible conductive pastes to identifying substrates that can withstand rigorous physical stress.
Physical and chemical manufacturing constraints require totally different design paradigms. Engineers must consider how materials survive environmental variables like thousands of cycles in a washing machine, or how to simulate electrical performance after a circuit has been thermoformed into a three-dimensional shape.
Even basic manufacturing processes like component attachment become major obstacles. Standard soldering techniques will easily melt low-temperature plastics like PET, making alternative bonding agents, low-temperature solders, or conductive adhesives critical areas of engineering exploration.
In this short video, you can learn:
* The material and design challenges when shifting from FR4 copper boards to FHE substrates.
* The physical reliability hurdles of flexible electronics, including washing machine survival and thermoforming.
* The thermal processing limitations of low-temperature plastics like PET during soldering.
📋 Clip Abstract: This clip details the steep learning curve and technical challenges electrical engineers face when moving from traditional FR4 PCBs to flexible hybrid electronics. It highlights key material compatibility, reliability, and thermal processing constraints essential for FHE design.
#FlexibleHybridElectronics, #LowTemperatureSoldering, #ThermoformedElectronics, #ConductiveAdhesives, #PrintedElectronics, #WearableElectronics
00:08:40 - 00:09:45
Can direct-write extrusion outperform inkjet printing for biomedical electrodes?
Can direct-write extrusion outperform inkjet printing for biomedical electrodes?
When fabricating temporary tattoo electrodes for biological signal capture, the choice of printing technology dictates the final electrical performance. Research comparing inkjet methods to direct-write extrusion reveals massive differences in sheet resistance and conductivity when using silver inks. Direct-write systems excel because they are compatible with high-viscosity formulations.
The empirical data demonstrates a stark contrast: inkjet-printed biomedical electrodes measured a sheet resistance of 25.1 kΩ/square, whereas extrusion-printed electrodes achieved 9.4 mΩ/square. This represents an improvement of over six orders of magnitude in conductivity, dramatically enhancing signal quality.
The ability to print highly conductive traces with high-viscosity pastes on flexible substrates makes direct-write extrusion uniquely suited for medical devices. This enables high-fidelity capture of biological signals without the high resistance associated with thin, inkjet-deposited layers.
In this short video, you can learn:
* The performance comparison between inkjet and direct-write extrusion printing for biomedical electrodes.
* Why high-viscosity pastes are necessary to achieve ultra-low sheet resistance down to the milliohm range.
* The empirical sheet resistance data showing a six-orders-of-magnitude difference in silver ink performance.
📋 Clip Abstract: This clip showcases research from York University comparing inkjet printing and direct-write extrusion for silver biomedical electrodes. It highlights how high-viscosity extrusion yields vastly superior conductivity, lowering sheet resistance from 25.1 kΩ/sq to 9.4 mΩ/sq.
#DirectWriteExtrusion, #BiomedicalElectrodes, #ConductivePastes, #SheetResistance, #PrintedElectronics, #Bioelectronics
00:06:19 - 00:07:35
How do you dispense high-viscosity materials down to 100 microns on flexible substrates?
How do you dispense high-viscosity materials down to 100 microns on flexible substrates?
Direct-write technology offers a versatile path for prototyping additive electronics on non-traditional substrates. The Voltera Nova platform utilizes direct-write extrusion to dispense high-viscosity materials—such as conductive and resistive pastes, epoxies, silicones, and other functional materials. This provides engineers with material freedom that traditional printing methods cannot match.
The system is designed to handle flexible and delicate substrates like TPU, PET, and high-temperature ceramics. Achieving consistent deposition requires precise control, which is enabled by an integrated pressure sensor designed to work with screen-printable inks, allowing trace widths down to 100 microns.
To ensure alignment and deposition accuracy on flexible films, the platform utilizes specialized fixturing, a built-in vacuum table, and an onboard camera. This combination eliminates positioning errors and facilitates real-time inspection, overcoming the mechanical drift often associated with flexible materials.
In this short video, you can learn:
* The material capabilities of direct-write extrusion systems for dispensing high-viscosity materials.
* How integrated pressure sensors enable screen-printable ink deposition down to 100 microns.
* The importance of vacuum tables and camera alignment systems when printing on flexible substrates like TPU and PET.
📋 Clip Abstract: This clip introduces the Voltera Nova direct-write platform and explains how it dispenses high-viscosity functional materials onto flexible substrates. It highlights the hardware elements, such as pressure sensors and vacuum tables, required to print high-resolution traces on TPU and PET.
#DirectWriteExtrusion, #HighViscosityDispensing, #FlexibleSubstrates, #PrecisionDispensing, #PrintedElectronics, #AdditiveElectronics