Jesus Zozaya | Voltera: Why is printing the second layer of a circuit 10x harder than printing the first?
11:54 - 13:32
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Summary of the clip:
Why is printing the second layer of a circuit 10x harder than printing the first?
A primary challenge in multi-layer printing is managing the wide variety of materials involved. Each distinct material, from conductive silver to the zinc anode, has a unique viscosity and particle size. This requires developing and optimizing a unique set of print parameters—nozzle diameter, print height, pressure, and speed—for every single layer, a complex and time-consuming task.
Furthermore, the topography of the substrate changes fundamentally after the first layer. While the initial print is on a perfectly flat surface, the second layer must be deposited onto a "flat-ish" surface with raised features. As more layers are added, the surface becomes increasingly complex and non-planar, requiring sophisticated height mapping to maintain the critical nozzle standoff distance for consistent deposition.
Finally, the process is complicated by the unique curing requirements for each material and the need for perfect alignment. Some layers may need one minute at 100°C while others need two minutes at 200°C. Each time the substrate is removed for curing and returned, it must be aligned perfectly, as any misalignment in the fold-over construction can lead to electrolyte leakage and device failure.
In this short video, you can learn:
* How material properties (viscosity, particle size) impact process parameters for each layer.
* The critical challenge of printing on non-planar topography as layers are built up.
* The combined difficulty of managing unique curing profiles and maintaining precise layer-to-layer alignment.
📋 **Clip Abstract** Discover the hidden complexities of multi-layer additive electronics that go beyond simple deposition. This clip reveals the practical challenges, from optimizing print parameters for seven different materials to the critical issue of printing on increasingly uneven surfaces.
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#MultiLayerPrinting, #NonPlanarPrinting, #MaterialRheology, #LayerAlignment, #ElectrochemicalCells, #FlexibleElectronics
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Multi-layer Printed Battery for Versatile Integration in Wearables, Medical Applications, Smart Packaging, Smart Sensors, and more
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00:01:32 - 00:02:46
Why is transitioning from FR4 copper to flexible hybrid electronics (FHE) so difficult?
Why is transitioning from FR4 copper to flexible hybrid electronics (FHE) so difficult?
Flexible hybrid electronics (FHE) represent a radical shift from traditional rigid printed circuit boards. For electrical engineers accustomed to copper on FR4 substrates, designing FHE from scratch introduces highly complex, unfamiliar materials challenges. These range from choosing the right biocompatible conductive pastes to identifying substrates that can withstand rigorous physical stress.
Physical and chemical manufacturing constraints require totally different design paradigms. Engineers must consider how materials survive environmental variables like thousands of cycles in a washing machine, or how to simulate electrical performance after a circuit has been thermoformed into a three-dimensional shape.
Even basic manufacturing processes like component attachment become major obstacles. Standard soldering techniques will easily melt low-temperature plastics like PET, making alternative bonding agents, low-temperature solders, or conductive adhesives critical areas of engineering exploration.
In this short video, you can learn:
* The material and design challenges when shifting from FR4 copper boards to FHE substrates.
* The physical reliability hurdles of flexible electronics, including washing machine survival and thermoforming.
* The thermal processing limitations of low-temperature plastics like PET during soldering.
📋 Clip Abstract: This clip details the steep learning curve and technical challenges electrical engineers face when moving from traditional FR4 PCBs to flexible hybrid electronics. It highlights key material compatibility, reliability, and thermal processing constraints essential for FHE design.
#FlexibleHybridElectronics, #LowTemperatureSoldering, #ThermoformedElectronics, #ConductiveAdhesives, #PrintedElectronics, #WearableElectronics
00:08:40 - 00:09:45
Can direct-write extrusion outperform inkjet printing for biomedical electrodes?
Can direct-write extrusion outperform inkjet printing for biomedical electrodes?
When fabricating temporary tattoo electrodes for biological signal capture, the choice of printing technology dictates the final electrical performance. Research comparing inkjet methods to direct-write extrusion reveals massive differences in sheet resistance and conductivity when using silver inks. Direct-write systems excel because they are compatible with high-viscosity formulations.
The empirical data demonstrates a stark contrast: inkjet-printed biomedical electrodes measured a sheet resistance of 25.1 kΩ/square, whereas extrusion-printed electrodes achieved 9.4 mΩ/square. This represents an improvement of over six orders of magnitude in conductivity, dramatically enhancing signal quality.
The ability to print highly conductive traces with high-viscosity pastes on flexible substrates makes direct-write extrusion uniquely suited for medical devices. This enables high-fidelity capture of biological signals without the high resistance associated with thin, inkjet-deposited layers.
In this short video, you can learn:
* The performance comparison between inkjet and direct-write extrusion printing for biomedical electrodes.
* Why high-viscosity pastes are necessary to achieve ultra-low sheet resistance down to the milliohm range.
* The empirical sheet resistance data showing a six-orders-of-magnitude difference in silver ink performance.
📋 Clip Abstract: This clip showcases research from York University comparing inkjet printing and direct-write extrusion for silver biomedical electrodes. It highlights how high-viscosity extrusion yields vastly superior conductivity, lowering sheet resistance from 25.1 kΩ/sq to 9.4 mΩ/sq.
#DirectWriteExtrusion, #BiomedicalElectrodes, #ConductivePastes, #SheetResistance, #PrintedElectronics, #Bioelectronics
00:06:19 - 00:07:35
How do you dispense high-viscosity materials down to 100 microns on flexible substrates?
How do you dispense high-viscosity materials down to 100 microns on flexible substrates?
Direct-write technology offers a versatile path for prototyping additive electronics on non-traditional substrates. The Voltera Nova platform utilizes direct-write extrusion to dispense high-viscosity materials—such as conductive and resistive pastes, epoxies, silicones, and other functional materials. This provides engineers with material freedom that traditional printing methods cannot match.
The system is designed to handle flexible and delicate substrates like TPU, PET, and high-temperature ceramics. Achieving consistent deposition requires precise control, which is enabled by an integrated pressure sensor designed to work with screen-printable inks, allowing trace widths down to 100 microns.
To ensure alignment and deposition accuracy on flexible films, the platform utilizes specialized fixturing, a built-in vacuum table, and an onboard camera. This combination eliminates positioning errors and facilitates real-time inspection, overcoming the mechanical drift often associated with flexible materials.
In this short video, you can learn:
* The material capabilities of direct-write extrusion systems for dispensing high-viscosity materials.
* How integrated pressure sensors enable screen-printable ink deposition down to 100 microns.
* The importance of vacuum tables and camera alignment systems when printing on flexible substrates like TPU and PET.
📋 Clip Abstract: This clip introduces the Voltera Nova direct-write platform and explains how it dispenses high-viscosity functional materials onto flexible substrates. It highlights the hardware elements, such as pressure sensors and vacuum tables, required to print high-resolution traces on TPU and PET.
#DirectWriteExtrusion, #HighViscosityDispensing, #FlexibleSubstrates, #PrecisionDispensing, #PrintedElectronics, #AdditiveElectronics